Used NOVELLUS CONCEPT 2 Dual Sequel #9092631 for sale

ID: 9092631
Wafer Size: 6"
CVD system, 6" Software: C2.SEQ_4.92B15 Operating system: QNX4 SECS GEM: Yes Free cable length: 75 Ft RF Cable length: 84 Ft Indexer firmware: 2.0_G Transfer robot: Brooks Mag 7 Chamber location: Left Chamber model: C2-CVDD-S SEQX EPD: Verity dual wavelength Shower head: Al 6061 8" 16-033931-00  Handling wafer size: 6" Heater block: No slot Sequel STN 1 pin 19-00154-04 Spindle speed: Standard Fork assembly: Ceramic anti-deflect 15-101482-00 15-101482-01 15-00700-00 Fork type: Min Contact 15-053394-02 Spindle feed through: Ferro fluidic Primary process gauge: 10T Gate & throttle valve: Heated / Internal 02-260348-00 16210-0403QS-002HJR MFC Type: Brooks GF100 IOC Software version: 4.2 RF Switching option: Yes RPC (Remote plasma clean): No    HF RF Generator: AE Apex 5513 LF RF Generator: AE PDX 1400 RF Match AE mercury: 3013 Foreline heated: No 2.0  MFC C Open MFC B N2 (10000 sccm) MFC A N2O (20000 sccm) MFC 9 NF3 (5000 sccm) MFC 8 O2 (20000 sccm) MFC 7 Open MFC 6 NH3 (10000 sccm) MFC 5 Open MFC 4 Open MFC 3 Open MFC 2 N2 (5000 sccm) MFC 1 SiH4 (1000 sccm) Chamber location: Rear Chamber model: C2-CVDD-S SEQX EPD: Verity dual wavelength Shower head: Al 6061 8" 16-033931-00  Handling wafer size: 6" Heater block: No slot Sequel STN 1 pin 19-00154-04 Spindle speed: Standard Fork assembly: Ceramic anti-deflect 15-101482-00 15-101482-01 15-00700-00 Fork type: Min Contact 15-053394-02 Spindle feed through: Ferro fluidic Primary process gauge: 10T Gate & throttle valve: Heated / Internal 02-260348-00 16210-0403QS-002HJR MFC Type: Brooks GF100 IOC Software version: 4.2 RF Switching option: Yes RPC (Remote plasma clean): No    HF RF Generator: AE Apex 5513 LF RF Generator: AE PDX 1400 RF Match AE mercury: 3013 Foreline heated: No 2.0 MFC C Open MFC B N2 (10000 sccm) MFC A N2O (20000 sccm) MFC 9 NF3 (5000 sccm) MFC 8 O2 (20000 sccm) MFC 7 Open MFC 6 NH3 (10000 sccm) MFC 5 Open MFC 4 Open MFC 3 Open MFC 2 N2 (5000 sccm) MFC 1 SiH4 (1000 sccm) System main power: 3ϕ 5Wires 208V System UPS power: 3ϕ 3Wires 120V SMIF Interface: No Aligner option: No Loadlock dry pump model: No Slit valve insert: No Slit valve type: SMC L-Motion TM Dry pump model: No TM Throttle valve: MKS 253B TM BARATRON model: MKS Front monitor: 12" LCD Chase monitor : LCD Loadlock BARATRON model: No Indexer robot type: Indexer II IOC Version: 4.1 TM Robot type: Mag 7 TM Robot blade: Ceramic Software revision: 4.80 B22 Signal tower: Yes Module controller: MC1 Host interface: SECS Module A: Express Process A: SiH4 Base Module B: Express Process B: SiH4 Base System and DLCM: MC1 (P166 64M) System DLCM Module controller MSSD (2 Sequel configuration) power rack Upgrade 4 cool station SiH4 Base oxide process Signal cables RF Coaxial cables MKS 253B throttle valve 651D Throttle valve controller MAG 7 Transfer robot Dual arm Indexer robot Animatics controller Standard shuttle assy Chase PC and table Generator rack Process module: Chamber type: Shrink Chamber process: SiH4 base Process clean type: In Situ Endpoint option: No Module controller: MC1 Heater block type: Standard Module dry pump: No Manometer 1(10T): MKS 627A11TBC Throttle valve: MKS 253B-15665 Spindle topplate type: Standard IOC2 option: Ver 4.1 Manometer 2(100T): MKS 627A13TBC HF Generator: RFG5500 LF Generator: PDX1400 RF Match: AE Mercury 3013 TEOS Delivery cabinet: No IOC Version: 4.1 Foreline gate heat option: Yes Foreline gate valve type: HVA Chamber gas box: Gas name MFC Size MFC Model SiH4 1 SLM AERA 7800 N2A 5 SLM AERA 7800 N2B 10 SLM AERA 7800 N20 20 SLM AERA 7800 NH3 10 SLM AERA 7800 O2 20 SLM AERA 7800 C2F6 5 SLM AERA 7800 Module A : Gas filters Gas box HF and LF RF Generators RF Matching network Lower spindle assy Ferrofluidic spindle Assy Bottom and top plates 10Torr and 1000Torr manometer Heated type HVA gate and MKS throttle valves Throttle valve controller Upgrade MC1 (P166 64M) module controller Ceramic type spindle fork assy O-Rings Metal parts in chamber Watlow temp controller Window shappire Heater ISO box TC gauge MFC's Heater block (OPM) Shower head RF and heater feedthru 2000-2001 vintage.
NOVELLUS CONCEPT 2 Dual Sequel is a reactor designed and manufactured by NOVELLUS Systems, Inc., a leading provider of plasma-based chemical vapor deposition (CVD) systems. The reactor is used in the fabrication of semiconductor devices in the sub- and ultra-micron sizes, and is well-suited for high-volume production of these components. This reactor includes a unique dual-chamber design that utilizes two separate chambers to deposit materials onto a substrate. The Dual Sequel reactor utilizes a chamber pressure of up to 10 Torr for deposition processes, ranging from very low to high film thicknesses. It also includes a detector unit for constant monitoring of the deposition process. For retaining thermal uniformity across the wafer, the reactor includes a wafer cooling feature designed to reduce detrimental effects from changes in wall temperature. Furthermore, this feature also helps to eliminate impurities from the process. The Dual Sequel reactor comes with a unique interlock equipment, which works by connecting the process chambers with one another via a shared vacuum line. This interlock ensures that both the chambers are working in tandem, thereby delivering reliable and consistent performance. The interlock also helps in regulating pressure throughout the system, allowing the chamber pressure to remain in the intended range. Other features include a highly-efficient gas delivery unit which helps in minimizing the use of process gases. The machine also operates in a special 'half-on' mode which can be used to speed up the process by performing a series of processes simultaneously. In addition, the Dual Sequel also provides a higher level of safety due to its advanced safety features like an emergency pump tool and a safety interlock. Overall, CONCEPT 2 Dual Sequel reactor is an advanced, high- throughput, and reliable CVD tool that is well-suited for high-volume production of small-sized semiconductor components. Its unique dual-chamber design offers greater levels of deposition and temperature control, while its interlock asset allows for a more unified and efficient process. It also boasts a range of features designed to enhance safety, minimize process gases, and boost throughput.
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