Used NOVELLUS Concept 2 Dual Speed #9259411 for sale

NOVELLUS Concept 2 Dual Speed reactor is an advanced reactive ion etching (RIE) tool that utilizes two separate pulsed plasma levels to achieve a higher etching rate while maintaining precise etching selectivity. It is capable of performing both etch and deposition processes in a single equipment. This combination of dual pulsed plasma sources and etch/deposition chamber technology enables the Concept 2 to effectively etch both dielectric and metal layers with precise process control and superior results. The Concept 2 is an industrial-grade RIE tool with a dual speed, dual frequency, and dual pulsed high-density plasma source. This allows for chemical reactivity, control of ion-neutrals rates, power tuning, and modulation of process gases. Its dual pulsed plasma sources can generate both singly-charged and multiply-charged species, which allow for precise etching of dielectrics and metals. The Concept 2 also offers flexible process control, with arbitrary waveforms and pulse widths. The Concept 2's RIE technology also enables high-precision etching of various materials in a single system. It has integrated hardware to efficiently control film thickness uniformity, etch-smoothing, and pattern profile control. The Concept 2 also guarantees reproducible etch rates, features a range of process chambers, and utilizes passivated reactors to prevent contamination. This requires loading of recipe parameters to ensure repeatability of the etching process. The Concept 2's RIE technology allows etching of various materials in one unit for large-scale production. It features a broad process window, which enables etching of dielectric and metal layers with precise control. The machine's course wafer loading and high throughput capabilities make it ideal for high-volume production. Additionally, the Concept 2 is highly efficient and energy-efficient, utilizing closed-cycle coolers to reduce tool power consumption. This makes it a great choice for any production process.