Used NOVELLUS CONCEPT 2 Sequel Express #9243045 for sale

NOVELLUS CONCEPT 2 Sequel Express is a tool for chemical vapor deposition (CVD) reactor technology. It is a single-wafer, small-footprint equipment used for the deposition of thin-film layers on silicon wafers and other substrates. The system uses advanced process control algorithms and precision deposition head and substrate motion systems to achieve greater precision, faster cycle times, and improved throughput performance. CONCEPT 2 Sequel Express process allows a variety of thin-film materials to be deposited. It is equipped with a large variety of process gases, enabling uniformity and minimizing non-uniformity of the deposited layer. The unit utilizes a single-wafer, multi-zone high-density plasma (HDP) source for the deposition of dielectric films, metallization layers, passivation layers, and barrier layers. The HDP process is enhanced by the incorporation of a reactant flow focusing (RFF) module that permits independent control of the antioxidant gas flow. In addition, the RFF module allows the generation of custom and predefined plasma profiles, enhancing deposition quality and control of film thickness. The machine also comes equipped with a patented substrate stage motion control feature which is designed to reduce non-uniformity on the wafer. This feature enables precise control of the substrate motion and positioning of adjacent films. A low-energy bias can also be introduced to the substrate, promoting uniform film growth. NOVELLUS CONCEPT 2 Sequel Express also employs a variety of advanced process controls to improve process uniformity and repeatability. It includes technologies such as substrate tilt control and variable substrate bias control, which are designed to ensure uniformity within and across the wafer. In addition, the tool has a multiple in-situ reflectometry monitoring asset which allows users to measure various qualities such as line width, total thickness, etchback, and deposition rate. CONCEPT 2 Sequel Express model is a powerful CVD production tool for use in semiconductor device fabrication. It boasts advanced process control algorithms and precise deposition head and substrate motion systems. It is capable of depositing a variety of thin-film materials, with independent control of antioxidant gas flow and adjustable substrate bias. Additionally, its advanced process controls and in-situ monitoring equipment provide improved process uniformity and repeatability.