Used NOVELLUS CONCEPT 2 Speed #9075495 for sale
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ID: 9075495
Wafer Size: 8"
Vintage: 2004
HDP CVD System, 8"
Type: Shrink
Process: STI / IMD
Wafer shape: Notch
Module A: shrink
Module B: shrink
Module B: shrink
MKS Load lock baratron
TM Robot: Mag 7
Ceramic TM Robot blade
MC1 Module controller
Existence wafer sensor
EMO: Turn to release
SECS
IOC Version: 4.1
LCD Front monitor, 12"
DLCM Gas MFC:
UPC1(L L/L) Ar/He 1SLM Brooks 5866
UPC2(R L/L) Ar/He 1SLM Brooks 5866
MFC3 Ar/He 500 Sccm Brooks 5964
Chamber (A, B, C):
Chamber Type: Shrink
Chamber Process: STI / IMD
MC1 Module controller
Throttle valve: MKS 651D
HF Generator: AE RFG5500
IOC Version: 4.1
Pedestal lift type: Dual position
Module turbo pump: Pfeiffer TMH 2101 PCX
ESC / Dome cooling: PCW
LF Generator: AE PDX 8000
Dual clean injector kit
Fore line type: Universal
ESC Type: DS1
Manometer 1(10T): MKS629B
Manometer 2(10T): MKS629B
Manometer 3(100 m): MKS750B
Process clean type: In situ
RF Match: MECURY 3013
Injector type: Single
Injector Size,1"
Chamber gas box:
MFC 1 Ar 500 STEC
MFC 2 O2 500 STEC
MFC 3 NF3 1000 STEC
MFC 4 SiH4 200 STEC
MFC 5 HE 1000 STEC
MFC 8 H2 2000 STEC
System main power: 3-208 V
System UPS Power: 3-120 V
Slit valve insert
Slit valve type: SMC L-Motion
TM Turbo pump model: Pfeiffer TMH 260
TM Throttle valve model: Tylan
MKS TM Baratron model
2004 vintage.
NOVELLUS CONCEPT 2 Speed is a chemical mechanical polishing (CMP) reactor used to flatten surfaces of semiconductor wafers. It is used for various tasks such as removing standoff, scratches, and other contaminants to create extremely uniform and smooth surfaces. CONCEPT 2 Speed is designed with a very compact and efficient footprint, making it easy to install in any type of workspace. This reactor features two high-precision, high-speed wafer carriers that can handle up to two 300mm wafers in one cycle. It also has an advanced robotic arm for wafer loading and unloading, ensuring consistent and efficient processing. NOVELLUS CONCEPT 2 Speed can handle most polishing sequences, including tape removers, thinners, pad condensers, and lubricators. This reactor utilizes a flexible dual-magnetic fore-aft axes configuration, which allows for independent adjustment of the two axes. This flexibility provides for optimal pad contact and process control. It also includes numerous sensors that can detect contamination levels, process conditions, and pad temperature. CONCEPT 2 Speed also features a powerful slurry spreading system that quickly and evenly distributes liquid slurries during processing. NOVELLUS CONCEPT 2 Speed is equipped with several innovative technologies that aim to enhance its performance. This reactor includes a wafer mapping module that can create precise pattern of-its-kind maps detailing the surface layer of the wafer. It also has a slurry exhaustion monitoring system that monitors the remaining slurry amount, prevents over-polishing, and monitors system performance. Overall, CONCEPT 2 Speed is an advanced CMP reactor that offers improved performance and reliability for high-volume polishing applications. It is designed to be highly efficient and requires minimal operator interaction, making it the perfect choice for precision CMP applications.
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