Used NOVELLUS CONCEPT 2 Speed #9075495 for sale

Manufacturer
NOVELLUS
Model
CONCEPT 2 Speed
ID: 9075495
Wafer Size: 8"
Vintage: 2004
HDP CVD System, 8" Type: Shrink Process: STI / IMD Wafer shape: Notch Module A: shrink Module B: shrink Module B: shrink MKS Load lock baratron TM Robot: Mag 7 Ceramic TM Robot blade MC1 Module controller Existence wafer sensor EMO: Turn to release SECS IOC Version: 4.1 LCD Front monitor, 12" DLCM Gas MFC: UPC1(L L/L) Ar/He 1SLM Brooks 5866 UPC2(R L/L) Ar/He 1SLM Brooks 5866 MFC3 Ar/He 500 Sccm Brooks 5964 Chamber (A, B, C): Chamber Type: Shrink Chamber Process: STI / IMD MC1 Module controller Throttle valve: MKS 651D HF Generator: AE RFG5500 IOC Version: 4.1 Pedestal lift type: Dual position Module turbo pump: Pfeiffer TMH 2101 PCX ESC / Dome cooling: PCW LF Generator: AE PDX 8000 Dual clean injector kit Fore line type: Universal ESC Type: DS1 Manometer 1(10T): MKS629B Manometer 2(10T): MKS629B Manometer 3(100 m): MKS750B Process clean type: In situ RF Match: MECURY 3013 Injector type: Single Injector Size,1" Chamber gas box: MFC 1 Ar 500 STEC MFC 2 O2 500 STEC MFC 3 NF3 1000 STEC MFC 4 SiH4 200 STEC MFC 5 HE 1000 STEC MFC 8 H2 2000 STEC System main power: 3-208 V System UPS Power: 3-120 V Slit valve insert Slit valve type: SMC L-Motion TM Turbo pump model: Pfeiffer TMH 260 TM Throttle valve model: Tylan MKS TM Baratron model 2004 vintage.
NOVELLUS CONCEPT 2 Speed is a chemical mechanical polishing (CMP) reactor used to flatten surfaces of semiconductor wafers. It is used for various tasks such as removing standoff, scratches, and other contaminants to create extremely uniform and smooth surfaces. CONCEPT 2 Speed is designed with a very compact and efficient footprint, making it easy to install in any type of workspace. This reactor features two high-precision, high-speed wafer carriers that can handle up to two 300mm wafers in one cycle. It also has an advanced robotic arm for wafer loading and unloading, ensuring consistent and efficient processing. NOVELLUS CONCEPT 2 Speed can handle most polishing sequences, including tape removers, thinners, pad condensers, and lubricators. This reactor utilizes a flexible dual-magnetic fore-aft axes configuration, which allows for independent adjustment of the two axes. This flexibility provides for optimal pad contact and process control. It also includes numerous sensors that can detect contamination levels, process conditions, and pad temperature. CONCEPT 2 Speed also features a powerful slurry spreading system that quickly and evenly distributes liquid slurries during processing. NOVELLUS CONCEPT 2 Speed is equipped with several innovative technologies that aim to enhance its performance. This reactor includes a wafer mapping module that can create precise pattern of-its-kind maps detailing the surface layer of the wafer. It also has a slurry exhaustion monitoring system that monitors the remaining slurry amount, prevents over-polishing, and monitors system performance. Overall, CONCEPT 2 Speed is an advanced CMP reactor that offers improved performance and reliability for high-volume polishing applications. It is designed to be highly efficient and requires minimal operator interaction, making it the perfect choice for precision CMP applications.
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