Used NOVELLUS Concept 3 Altus #9248122 for sale
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ID: 9248122
Wafer Size: 12"
CVD System, 12"
Dual chamber
BROOKS AUTOMATION Robot
Load port: 3-FOUP
Pre aligner and centering: Single axis
Mainframe: Platform type: Wafer transfer module, 12"
Load lock:
(2) Load locks
(3) Load lock cooling pedestals
Chambers: Altus C3 Mod A / Mod B
MKS Astron RPS Power supply
Pedestal:
Al Heater pedestals with lift pins (Station 1)
Al Heater pedestals (Stations 2-4)
Gas panel:
MFC / Gas / Size (SCCM)
MFC-P / Ar-F / 20000
MFC-N / B2H6-D / 500
MFC-M / Ar PNL / 20000
MFC-K / WF6-N / 500
MFC-J / WF6-M / 500
MFC-I / NF3 / 5000
MFC-G / SiH4-K / 500
MFC-F / Ar-K / 5000
MFC-E / WF6-J / 500
MFC-D / Ar-H / 50000
MFC-C / Ar CVD / 20000
MFC 9 / H2-C / 30000
MFC 8 / Ar-C / 20000
MFC 5 / WF6-W / 500
MFC 4 / Ar-B / 20000
MFC 3 / H2-A / 30000
MFC 2 / SiH4-D / 500
MFC 1 / Ar-D / 5000
APC 1 / Argon / 3000
Component:
NOVELLUS 01-172346-12 SSD Power rack
651WF Scrubber
Module A:
BOC EDWARDS iH1000 Pump
KASHIYAMA SDE90 Pump
Module B:
BOC EDWARDS iH1000 Pump
(3) KASHIYAMA SDE90 Pump.
NOVELLUS Concept 3 Altus is a highly advanced, next-generation etch reactor designed for a variety of applications in advanced semiconductor manufacturing. The reactor utilizes both hardware and software to maximize accuracy and throughput in the etching process. At its core, Concept 3 Altus utilizes a single large three zone dual-plasma torch design. This configuration offers a multitude of benefits including improved precursor throughput, improved deposition rates, and greater uniformity across the substrate. The torch has been optimized for improved electrical efficiency and is capable of achieving high throughputs in etching applications. Additionally, the three zones allow for a greater range of power levels to be applied across the whole substrate. The reactor is designed to use a three-step plasma etching process. First, the reactor pre-coats the substrate with a polymer layer which minimizes damage to the substrate caused by the etching process. Secondly, the reactor applies a high-power plasma step over the substrate and into the underlying layers. Finally, the reactor finishes the etching process by allowing a rapid isotropic etching to occur. For optimal etching performance, NOVELLUS Concept 3 Altus enables the use of specialized computer software known as "QChamber." This software ensures optimization of each etching process through detailed analysis of the plasma conditions, and also includes special cross-sectional imaging technology to analyze etch profile. QChamber also allows for monitoring of multiple process levels, including coding and deposition rates, crossover detection, and arc disruption. In addition to the QChamber, Concept 3 Altus can be integrated with other process control systems. This allows for more customization and greater precision during the etching process. It also enables the use of advanced features such as process-in-place (PiP) cleaning, which improves the efficiency of each etching run. NOVELLUS Concept 3 Altus is a powerful tool for the modern semiconductor manufacturer. It offers advanced levels of precision and control for etching and other processes essential to the production chain. With powerful hardware, advanced software, and industry-leading features, Concept 3 Altus is highly capable and offers a competitive edge to any chipmaker.
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