Used NOVELLUS CONCEPT 3 Speed XT #9096022 for sale

NOVELLUS CONCEPT 3 Speed XT is an advanced plasma-enhanced chemical vapor deposition (PECVD) reactor. It is designed for the deposition of thin films from a wide range of materials including polysilicon, SiO2, a-Si:H, poly-SiGe, Poly-SiON, and silicon nitride. It is ideal for applications including memory, flat panel displays, and multi-layer stacks. CONCEPT 3 Speed XT is equipped with a high-powered electron cyclotron resonance (ECR) source for enhanced performance and improved quality of the thin films deposited. This source employs the use of up to four microwave frequencies in order to increase the critical temperatures for a given process, which in turn improves the quality of the films and eliminates the need for additional source scrubbing between processes. NOVELLUS CONCEPT 3 Speed XT is also constructed with a 16-station wafer handling equipment, which can accommodate up to 120 wafers per run. This system is designed for efficient, precise loading and unloading of the wafers, and is capable of accommodating the largest wafer sizes. It is also built with a uniform temperature control unit in order to maintain the optimal deposition temperature across the entire run. CONCEPT 3 Speed XT is also equipped with an advanced ion-assisted deposition (IAD) machine. This tool enables precise control of the dopants in the films in order to meet the exact specifications of each application without the need for additional external sources of dopants. The IAD asset also helps reduce particle contamination and helps ensure the repeatability of the process. Finally, NOVELLUS CONCEPT 3 Speed XT features a graphite hot wall chamber, which helps to improve substrate temperature uniformity and reduce unwanted film erosion. This chamber is also capable of controlling the O2 flow in order to facilitate the deposition of silicon nitride and other complex stacks. All of the features of CONCEPT 3 Speed XT allow it to provide superior film quality and high throughput in the most complex and challenging deposition environments. It is an ideal platform for the deposition of the latest memory, display, and multi-layer stacks for a wide range of applications.