Used NOVELLUS CONCEPT One #86630 for sale
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ID: 86630
CVD system, 6"
Wafer type: Major flat
Load lock chamber: Metal cassettes (3)
Vacuum system: External heated valve stack
Vacuum system: MKS type 652 throttle valve controller
Vacuum system: LL diffuser
Vacuum system: Digital LL pressure controller
Electrical system: Megapack power supply
Electrical system: NOVELLUS robot motor upgrade
Wafer spindle mechanism: Ferrofluidic seal
Wafer transfer mechanism: Non contact pin search
Wafer transfer mechanism: WOPS
Wafer transfer mechanism: Ucontainmation
Software: 4.333
End point detector: Single Verity endpoint model PM100
Control system: ELO touchscreen
Gas system: N2O upgrade
Gas system: Methane saver
RF system: Trazer match AMU201, HF ENI OEM-28B, LF
Top plate: Ceramic gas tube
Top plate: T-slot spindle upgrade from McDowell
Kalrez 9100 O-rings: 3 per Showerhead 2-012, 2-020, LL door 2-36
Software: 4.433
Robot: One arm
RF generator: ENI (OEM-28B and PL-2HF)
RF matching unit: Trazar (AMU2-1)
AC remote: NOVELLUS
Supporting equipment:
Remote power box / transf PL-2HF: Generator rack
PFC abatement system
Remote pwr / transformer OEM 28-B: Generator rack
Pumps / pumps support IQDP80 / QMB 1200: Dry
Pumps / pumps support QDP80: LL pump
Gas detection
Hook up regulators / valves
Heat jacket (For NV5 thru 8)
Gas box / Chem distribution: TEOS / TMP Sigma 6 cabinet TEOS Cabinet
Chiller / heat exchanger
Automation part
Gas box configuration:
Gas 1: Nitrogen (A1)
Gas 2: SiH4 (A2)
Gas 3: N2 (B1)
Gas 4: NH3 (B2)
Gas 5: C4F8 (B3)
Gas 6: O2 (B4)
Gas 7: N2O (B5)
Gas 8: CDA
Gas 9: TEOS
Gas 10: TMP.
NOVELLUS CONCEPT One is a next-generation co-sputtering reactor that provides high-performance, highly-selective and low-cost deposition of thin films. This chemical vapor deposition (CVD) tool is capable of scaling up the dimensional range of advanced substrates, making it ideal for creating device structures that range from 2 to 500 nanometers (nm) in thickness. It is designed to create high-quality layers and enable a range of processing options, such as directional or omni-directional etching. NOVELLUS CONCEPT ONE's patented process delivers uniform deposition in both the vertical and the horizontal directions via a single nozzle. This allows for the creation of a highly uniform, homogenous thin film, even across intricate or complex patterned substrates. Using directional sputtering rather than random bombardment results in a significantly higher surface topography quality than other CVD processes. As a result, CONCEPT One is ideal for applications requiring precision thin film component manufacturing. The reactor offers flexible substrate loading and processing options, enabling a variety of rapid methods for surface cleaning, etching, deposition, and planarization. Clear, stable process conditions are provided through NOVELLUS state-of-the-art process control software and integrated proprietary pressure technologies. Its customizable automation capabilities reduce the cost of process development for new clients and improve their overall cycle times. CONCEPT ONE facilitates a "green" approach to wafer processing by utilizing its energy-efficient, modular design to conserve energy, reduce emissions and minimize hazardous waste products. The reactor's Direct Heat Management technology precisely controls the process temperature and reduces the risk of component damage. Additionally, the CVD system offers an integrated panel-cleaning solution to reduce film buildup and expel contamination particles, while its Low Pressure option reduces the risk of chemical oxygen contamination and increases overall process stability. In conclusion, NOVELLUS CONCEPT One provides superior surface quality, a broad dimensional range, and flexible loading and processing options, all while promoting a green, energy-efficient approach to wafer processing. Its integrated and customizable automation capabilities enable rapid process development and cost-effective production, making it an ideal solution for a range of thin film component manufacturing applications.
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