Used NOVELLUS Inova NExT #9163189 for sale
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NOVELLUS Inova NExT is a revolutionary plasma-enhanced chemical vapor deposition (PECVD) platform. It is designed to provide advanced comprehensive processes for the deposition of high-performance thin films on semiconductor substrates. This platform is capable of delivering exceptional thin-film deposition capabilities with unmatched precision, high throughput and excellent repeatability. Inova NExT is a multi-source, multi-target PECVD equipment that allows for precise, fast and efficient deposition of dielectric and conductive films. It features several novel technologies, including patented high-density plasma technology, multi-source technology, and optimized substrate temperature control. These technologies allow the system to provide maximum performance and high uniformity for depositing thin dielectric and conductive films with superior film quality. The unit combines many technologies to provide advanced linear precisely-controlled layers of them films. For example, its patented high-density plasma technology enables it to deposit layers with precisely different densities and conductivities at extremely intricate steps and patterns, allowing for potential for advanced integrated circuits and other applications. In addition, the machine also offers excellent temperature control at the substrate level, enabling the precise deposition of dielectric layers at temperatures below 200°C. A key benefit of this capability is that it allows for deposition of thin films that are highly scalable and remain stable at high temperatures over extended periods. NOVELLUS Inova NExT also offers superior coverage, uniformity and conformality of well-defined metals, oxides and nitrides for advanced metal deposition processes. It includes advanced reactive gas distribution, precision temperature control and multi-source capability for producing uniform layers with excellent edge-adherence, even over tight corner-bends. Overall, Inova NExT is an advanced PECVD tool that provides precise, fast and efficient deposition of dielectric and conductive films, with superior film quality and unparalleled temperature control. It offers excellent repeatability, uniformity and coverage, and can be used for various advanced metal deposition processes, enabling advanced integrated circuits and other applications.
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