Used NOVELLUS Inova NExT #9236710 for sale

NOVELLUS Inova NExT (Next Generation Extrusion) is a revolutionary advanced deposition reactor designed to deliver ultra-precise film thickness control, improved process uniformity and uniform deposition rate while also providing repeatable materials' behavior with high-volume manufacturing requirements. The system utilizes dielectric trapping at the source and advanced reactive and inert gas flow control to accurately spray nanometer-level material onto substrates with extreme uniformity. Utilizing a high frequency, low power radio frequency signal (13.56 MHz) in a dual chamber configuration with integrated gas delivery and underlying substrate-clamping arrangement, NExT enables reactive gas species to be excited as it enters the chambers. The resulting reaction produces an energetic plasma, which is trapped in the central core of the reactor using a dry charge trapped in a dielectric material and distributed uniformly across the cavity. The resulting deposition of material onto the substrate is completely uniform, reproducible and controllable. The NExT reactor's RF generator can be deployed in either a peak or continuous mode to deliver the desired film thickness and uniformity at the highest possible throughput. The system is software-controlled and provides real-time feedback on parameters related to dielectric trapping, reactive gas flow, substrate-clamping arrangement and more. By utilizing this data, recipes can be created and precisely optimized to provide ultra-thin film deposition with minimal particle generation and high deposition rates. NExT is ideally suited for a wide range of material applications. These include high-k dielectrics, Multi-layered Capacitors (MLC), low-k dielectrics, barriers, and SLIM® capacitors. With production-ready memory stacking topographies now approaching up to 32 layers, this system opens up the possibility of unprecedented performance and levels of integration in a single die. Inova NExT offers significant advantages to both device manufacturers and end users. Its unique capabilities, combined with its ability to meet production requirements for device structural integrity, power performance and scaling/layering, create a solution that's capable of driving down the cost of ownership and adding value to the product.