Used NOVELLUS Inova #9284588 for sale

NOVELLUS Inova is a tool used in high-volume production of integrated circuits. It is a multi-wafer, high-precision plasma-based physical vapor deposition (PVD) tool that enables advanced deposition capabilities for wafer manufacturing. The equipment is equipped with a showerhead and source-high-lift processing capabilities, and is designed to enable advanced product deposition with improved deposition uniformity, exceptional thickness control, and high-throughput performance. The system consists of a central body that houses several components, including a showerhead, low-k film deposition engine, low-k backside drop engine, high-lift source, process chambers, and a scrubber. The showerhead includes a mixing chamber with a single inlet and several exhaust outlets. It also has adjustable gas diffuser plates and an adjustable nozzle to ensure optimal process control. The low-k film deposition engine works together with the high-lift source to provide superior film deposition capabilities. Its multi-zone control technology ensures precise deposition of various low-k thin films, achieving desired properties including high electrical conductivity, mechanical stability, and no pinholes or film defects. The low-k backside drop engine works in conjunction with the showerhead to deposit low-k backside drops. This ensures efficient device isolation and enables advanced lithography. The high-lift source is responsible for performing pre-fabrication and post-fabrication processes. It is equipped with several advanced features, including a process injection unit and uniformity adjustment machine. The high-lift source operates in high-speed mode to ensure high-throughput performance. The process chambers of the tool are equipped with multiple sources and a plasma torch to enable high deposition rates. The scrubber works in tandem with the process chambers to remove chemical contaminants, ensuring that the asset meets environmental and health standards. Inova is ideal for wafer fabrication, enabling deposition of low-k thin films with excellent performance characteristics. The ability to process multiple wafers at a time increases throughput and eliminates the need for frequent equipment changeover. This results in lower downtime and increased production efficiency. Furthermore, the model offers superior accuracy and reliability, making it an ideal choice for high-volume production environments.