Used NOVELLUS Sabre Next 200 #9378024 for sale

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Manufacturer
NOVELLUS
Model
Sabre Next 200
ID: 9378024
Wafer Size: 6"
Vintage: 2012
Copper electro-plating system, 8" Proteus QN User interface: Side panel (2) System controllers: MC3 Process type: Low acid Signal tower: (3) Colors GEM HOST Connection type: RS232 Chase computer Bottom exhaust kit Bottom drain kit Input voltage: 208 VAC 50/60 Hz 100 Amps Anneal module: Cassette hander (2) Loadports Robot type: AccuTran 7 Robot firmware: 1.4 l (5) Anneals Anneal H2 gas concentration: 100% Process module: Wafer aligner: Dual sensor with Pneumatic Robot type: BROOKS AUTOMATION AQR7 End effector: SST with vacuum (Dual EE) Wafer handler: Robot type: AquaTran 7 Robot firmware: 1.8 E Cell configuration: Cell 1, 2 & 3: Clamshell type: Double pressure Non MCD Clamshell cup type: PPS Clamshell lift: IAI Clamshell cylinder configuration: Pressure vacuum cylinder Anode chamber: SAC (2) TI Cables SAC SAC Pump Rinse type: Standard Chuck type: PPS EBR size: 5 mm CCR ACRPEM Configuration: PEM1 CCR ACRPEM Configuration: PEM2 CCR ACRPEM Configuration: PEM3 Chemical Monitor System (CMS) Chemical Delivery System (CDS) Water chiller type: NESLAB HX-75 or HX-300 2012 vintage.
NOVELLUS Sabre Next 200 (SN200) reactor is a versatile deposition equipment designed for semiconductor processing applications. It combines the benefits of an industrial-strength physical vapor deposition (PVD) chamber with the precision of a chemical vapor deposition (CVD) system. Typical applications include the deposition of metals, oxides, and dielectrics to create circuit patterns and structures on semiconductor wafers. The SN200 is designed with deposition quality in mind. The SN200 offers high throughput and reproducible results with its two-zone high-speed linear transfer unit. The chamber features a large target area and is capable of deposition rates up to 6 cm3/min, making it suitable for efficient conditioning of large-area wafers. The chamber is equipped with particle sensors, allowing for reliable monitoring of the particle content in the processing environment. The reactor also provides tight temperature and flow control, enabling users to achieve uniform and conformal layer deposition on the wafer surface. The mass flow controllers in the SN200 use an advanced closed-loop algorithm to ensure precise control of reactive gas flow and temperature. This makes it possible to optimize the process conditions for complex applications with ease. The SN200 features programmable aerosols (outer showerhead ring), measuring up to 8 scattering points to help minimize particle contamination. The dual Faraday Shields and low inertia magnet provide effective gun shielding, preventing stray electrons from damaging the wafers. The two-target viewing port provides excellent visibility of the target and its particles during processing. The SN200 offers superior performance and reliability for demanding deposition processes, including precision gate oxide, photoresist, and Cu/barrier stack deposition challenges. The machine is designed to meet class F (the strictest) cleanroom requirements, providing an ultra-clean environment conducive for producing advanced semiconductor devices. Through its high deposition rates, precise temperature and flow control, and effective shielding, the SN200 delivers the reliable and high-yielding results required for successful device fabrication.
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