Used NOVELLUS SABRE NEXT 300 #9161711 for sale

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Manufacturer
NOVELLUS
Model
SABRE NEXT 300
ID: 9161711
Wafer Size: 12"
Vintage: 2009
Cu ECP, 12" Software OS: Windows Non-SMIF Automation online component: SECE Wafer type: Notch Inline flow: Left Software: Y2K completion: Yes WL & RL: RL library: Left PPD type: PPD2 Laser: LAM Stage: Ring chuck 2009 vintage.
NOVELLUS SABRE NEXT 300 is a single-wafer advanced plasma-based etch reactor capable of deep etch applications. Designed for use in the semiconductor industry, this reactor is used for the advanced etching of silicon, and other relevant compounds. The etch process is driven by a field-reconfigurable inductively coupled plasma (ICP) and a very high RF power density imparted by the multiple magnetic field ICP sources. This plasma equipment produces a wide range of plasma chemistries and energy distributions to ensure precision and fast etch processes. SABRE NEXT 300 is designed to have a very small footprint and a narrow process chamber to provide more control over etching conditions. It can be tuned with NOVELLUS Auxiliary Port, an easy to use graphical user interface that allows users to easily configure the parameters and set process performance. It also has an advanced gas delivery system that enables a range of chemistries to be embedded into the etch process. This increases flexibility and provides a greater level of course control over the process. NOVELLUS SABRE NEXT 300 is controlled with NOVELLUS Motor Controller, a state-of-the-art motion control unit that allows thorough control over moving components such as wafer motion, focus motion, and preprocess scanners. This ensures the precise and precise etching of the wafer. In addition, NOVELLUS Motor Controller also provides support for advanced new process chamber features, such as a direct injection cassette doping machine, which allows for precise doping. This reactor is completely configurable for a variety of different applications, as well as several types of substrates including various materials and geometries. SABRE NEXT 300 is capable of precise etching to depths of up to 0.5 micron and processes that produce minimum profile deviation. The universal PPC+ controller enables precise process measurements. NOVELLUS SABRE NEXT 300 is one of the premier plasma etch systems on the market, and its advanced etch platform ensures the production of tightly controlled process results and repeatable profiles. This reactor offers reliable and accurate patterning capabilities, along with improved throughput and reduced process time, making it the perfect solution for advanced etching needs.
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