Used NOVELLUS Speed #9262058 for sale

NOVELLUS Speed is an advanced reactor technology developed by NOVELLUS Systems, Inc. It is a high-performance reactor designed to enable faster, more cost-effective processes and production in the advanced semiconductor manufacturing industry. This reactor uses an advanced topographical method to process wafers in an efficient manner to increase overall throughput. The reactor is composed of a series of process chambers, aimed at delivering higher throughput for the most complex fabrication processes available today. This includes processes such as chemical-mechanical planarization (CMP), semiconductor thin films deposition, nozzle-based etch, plasma etch, and wafer cleaning. At the heart of Speed is the topographical uniformed wafer motion (TUWM) wafer transport technology. This technology utilizes precise confinement systems combined with automated motion tracking to keep the wafer in place within the chamber. This ensures a consistent patterning shape during the deposition process. Additionally, the TUWM wafer transport technology minimizes fluctuations within the uniformity index, reducing the need for chamber cleaning and reducing the potential particle contamination. NOVELLUS Speed reactor also utilizes a radical plasma source (RPS) to generate plasmas that are optimized for the various process requirements. This generates powerful, efficient plasmas to enable high-resolution processes. The RPS also incorporates tunable power control capability, allowing the reactor to tune to the processes within the chamber. The advanced Speed reactor also utilizes advanced temperature control to ensure consistent uniformity within the chamber. This ensures that the process chambers deliver consistent results throughout the processing cycles. The combination of these components enables NOVELLUS Speed reactor to deliver faster throughput and higher product yields with reduced costs. Overall, Speed is a revolutionary and advanced manufacturing technology designed for increased manufacturing throughput. This reactor relies on the combined application of advanced technologies, such as topographical uniformed wafer motion, radical plasma source, and optimal temperature control to deliver consistent, high-quality fabrication processes. As a result, this technology enables faster, more efficient and cost-effective production for the semiconductor fabrication industry.