Used OERLIKON / LEYBOLD KAI 1200 #293665785 for sale

OERLIKON / LEYBOLD KAI 1200
Manufacturer
OERLIKON / LEYBOLD
Model
KAI 1200
ID: 293665785
PECVD System Substrate size: 1.1 mm x 1.3 mm.
OERLIKON / LEYBOLD KAI 1200 is a high-temperature chemical vapor deposition (CVD) reactor designed for maximum flexibility and process control. This advanced reactor equipment is capable of depositing finely-engineered films with uniformity, high uniformity, and the highest quality on a variety of substrate materials. LEYBOLD KAI 1200 is ideal for applications requiring uniform film deposition in the range of 200Å to 400Å. OERLIKON KAI 1200 is based on a low temperature cold wall chamber design, which minimizes contamination and allows for ultra-fast cooldown times. The system features optimized reaction gate design, an infinitely adjustable reaction flux, and a temperature range of -50C° to 1600°C. The power supply unit is equipped with a variety of power sources, including DC, pulsed DC, and RF power sources, allowing for precise control of thermal processes. The advanced structural design of KAI 1200 enables uniform film deposition over large substrate areas. An automatic substrate exchange function, paired with the extremely short cooldown times, makes it possible to switch between different substrates quickly and reliably. The machine is also designed with an independent exhaust tool and gas flow control for each process chamber, ensuring a clean and optimal process environment. OERLIKON / LEYBOLD KAI 1200 is designed to be user-friendly and easy to operate. It includes a comprehensive display asset with a touch panel, operated via graphical user interface (GUI). In addition, it features a wide range of safety features, from vacuum loss detection to over-voltage protection. Furthermore, the model is programmable through a computerized control, allowing for repeatable process parameters and performance. In conclusion, LEYBOLD KAI 1200 is an advanced, high-temperature CVD reactor designed for maximum process control and uniform film deposition. Its low temperature cold wall chamber design, optimized reaction gate design, temperature ranges, and comprehensive display equipment enable maximum process efficiency. The system also includes a range of safety features, programmable control, and an automatic substrate exchange function for easy substrate processing.
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