Used ULVAC EX-650-C16 #9053847 for sale
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ULVAC EX-650-C16 is a high-end series radio frequency (RF) reactive ion etcher (RIE) equipment for use in the production of electronic components. This system utilizes several technological advances to provide precise and accurate etching of materials with unparalleled throughput. EX-650-C16 unit is composed of a main reactor chamber, an upper-level pre-chamber, an integrated sample loading machine, a computer-controlled gas injection tool and a post-treatment plasma chamber. The main reactor chamber is equipped with two 16-inch poles and one 8-inch pole with 2KW RF power supplies capable of up to 2.3 Torr vacuum pressure. This allows for an extremely high etching rate of up to 0.1um/min. It also uses a Turbulence optimization asset based on a four-quadrant design, allowing for enhanced uniformity of etch pattern formation. The upper-level pre-chamber utilizes a two-level plasma optimization model with three electrode pins to help provide precise, high-rate etching of delicate materials and substrates, and it boasts an even higher etching rate than that of the main reactor chamber. The integrated sample loading equipment makes sample changing easy with automated distance, securing and orientation control capabilities. It also provides a secure environment in which to handle sensitive materials. ULVAC EX-650-C16's advanced gas injection system allows for precise volumetric control and introduction of chemicals to the reactor's interior pressure chamber. This unit allows for the accurate optimization of etching of more exotic materials or layered substrates. Finally, the post-treatment plasma chamber utilizes two 25-inch UV lamps capable of up to 6 Torr of pressure and allows for high-precision post-processing. All of these features of EX-650-C16 team up to create a RIE machine that provides one of the most consistently accurate and precise etching profiles of any reactor currently available in the industry.
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