Used OKOS VUE 400 #9266141 for sale

OKOS VUE 400 is a scanning electron microscope (SEM) that offers comprehensive, high resolution imaging capabilities. It includes an ultra-high resolution detector with a range of magnifications up to 600 kV and a high-performance software suite for image analysis and simulations. The imaging capabilities of VUE 400 allow for a variety of applications, ranging from material characterization and surface inspection to 3D imaging and nanofabrication. OKOS VUE 400 includes an in-column field emission gun and high-resolution, single-axis deflection scanner. This combination provides excellent imaging capability and resolution, making VUE 400 ideal for everyday imaging as well as high resolution tasks such as 3D reconstructions and material analyses. The fields emission gun generates focused electron beams that are able to penetrate thin material specimens such as polymers and ceramic films. The column's ceramic vacuum insulation and hermetic sealing provide superior imaging stability and reliability. OKOS VUE 400 features a large 12.1" LCD monitor for easy operation and viewing, together with an efficient automated stage elevation mechanism that allows for efficient imaging while preserving sample integrity. The user-friendly software suite provides a range of image processing applications as well as a measurement library for automated analyses and reporting. In addition, an atomic force microscope (AFM) module is available, allowing users to explore nanoscale features of a sample. VUE 400 is designed to accommodate both in situ and ex situ sample environments. This ability to shift from one to the other provides flexible experimental possibilities. For instance, it can be used for in situ observations of fine structures in organic systems, and for ex situ observations of nanostructures. Lastly, OKOS VUE 400 is built with an open architecture that allows for compatibility with various microscope accessories. Its highly capable software and hardware opens up a world of research possibilities, from imaging to structure analysis, 3D reconstructions and more.