Used ACCRETECH / TSK 100A #9394630 for sale

ACCRETECH / TSK 100A is an advanced scribing and dicing equipment designed for use in the photonic device manufacturing industry. The system allows for high precision micro features to be produced, such as for photonic component production. The versatile machine combines features of both a laser scribing unit and a wafer dicing machine allowing for high accuracy scribing and dicing all in one tool. TSK 100A features a high precision workpiece stage, which is capable of automated acquisition and alignment of different sized workpieces. The automated acquisition sequence automatically aligns and secures the workpiece properly, ensuring accurate results for both the scribing and dicing operations. The asset offers an external camera option, allowing for imaging and profiling of the workpiece in real-time, enabling precise control of the scribing and dicing process. The machine also features a built-in laser beam delivery model with a wide selection of laser wavelengths and power levels to suit virtually any application. The laser scribing process is highly accurate and can be easily adjusted to suit each individual workpiece. The laser beam is then directed to the exact desired area on the workpiece where a scribe is made. For dicing operations, the equipment features a high speed diamond saw with a fine grade diamond dicing blade. The diamond dicing blade is designed to produce clean and consistent cuts while ensuring maximum longevity of the workpiece. The saw can be adjusted for various cutting depths, allowing for exacting precision when dicing. The system is designed for both 1 and 2 level processes and can be used to process any size/shape of the workpiece. ACCRETECH 100A can also be integrated with 3rd party software such as CAD/CAM for more advanced operations. Having a combination of scribing and dicing all in one unit, allows for a better control over the machining process and is much more efficient than if the operations were to be done separately. 100A scribing and dicing machine offers precision and flexibility for various microfeature machining applications in the photonics industry.