Used ACCRETECH / TSK 2500 #162748 for sale

ACCRETECH / TSK 2500
ID: 162748
Wafer Size: 6"
Dicing saw, 6".
ACCRETECH / TSK 2500 is an advanced scribing & dicing equipment, designed to provide the highest precision possible in dicing processes. TSK 2500 features a high-speed spindle motor that delivers maximum cutting power, reducing vibration and providing precise control of post-dicing processes. The laser scanning module allows for fast and precise positional tracking of the wafer center when dicing. ACCRETECH 2500 utilizes proprietary software algorithms to optimize the cutting and dicing process, providing highly accurate results with a minimum of material waste. The scribing and dicing functions are precisely controlled by a touchscreen, enabling operators to easily modify settings to suit each application. An integrated safety system minimizes the risk of operator injury by reducing grinding wheel breakage and preventing accidental spindle start up. 2500 has an internal memory capacity of up to 6,000 programs, allowing operators to program multiple jobs for repeat work. The unit can be networked for large-scale jobs and remote monitoring. Additionally, ACCRETECH / TSK 2500 has an integrated inspection machine that automatically checks wafers during the dicing process. This ensures sharp, clean edges on the wafer post-dicing, minimizing defects. TSK 2500 is a versatile scribing and dicing tool, capable of meeting the most demanding production requirements. The integrated safety features, ease of programming, and advanced cutting technology make ACCRETECH 2500 an ideal choice for high-precision dicing and scribing in any application.
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