Used ACCRETECH / TSK AD 20T #9134478 for sale
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ID: 9134478
Vintage: 2013
Dicing saw
Wafer size:
Round wafer: ø2"～ø8"
Square wafer: 25 mm to 250 mm
Applicable flame size: Ø5", Ø6", Ø8"
X-axis:
Cutting stroke: 280 mm (Range of accuracy guarantee: 250 mm)
Moving speed: 0.1～800 mm/sec (Cutting speed 0.1～400 mm/sec)
Y-axis:
Cutting area: 260 mm
Moving speed: Maximum 300 mm/sec
Z-axis:
Available stroke: 34 mm
Moving speed: Maximum 60 mm/sec
Camera specification:
Low magnification camera:
Pixels: 9.8 μm/pixel, 4.9 μm/Pixel
Visual range: 6.27mm x 4.70mm, 3.15mm x 4.19mm (when uses conversion lens)
Magnification: 1.0 Times (2.0 when uses conversion lens)
LED: Coax light, ring light (white）
High magnification camera:
Pixels: 1.25 μm/Pixel
Visual range: 0.79mm × 0.59mm
Magnification: 8.0 Times
LED: Coax light, ring light (white）
Utility specifications:
Air:
Pressure: 0.5～0.7 MPa
Consumption: Max. 455 L / min
Temperature: 20～25°C
Dew point: Less than -15°C
Residual oil: 0.1 PPM / Wt
Drain: Rc (PT) 3 / 8" female
Cooling water:
Pressure: 0.2～0.5 MPa
Consumption: Max 3.0 L / min
Drain: Rc(PT) 3 / 8” female
Temperature: 20～25°C
Plumbing specification: Return system
De-ionized water:
Pressure: 0.4～0.5 MPa
Consumption: Maximum 13.0 L / min
Drain: Rc (PT) 3 / 8" female
Temperature: 20～25°C
Exhaust
Displacement: More than 5 m³ / min
Vent: Bore 100φ for a hose
Draining
Displacement: Max 30 L / min
Vent: Bore 50φ for a hose
Power supply: AC 200V / AC220V ±10%, 4 kVA, 3 Phase, 50/60 Hz
2013 vintage.
ACCRETECH / TSK AD 20T is an automated scribing and dicing equipment designed for precision alignment and pattern-based device applications. It provides an ideal platform for die attach, wire bond, encapsulate, solder paste, and bonding applications. TSK AD 20T system utilizes a high-resolution digital camera to precisely scan and align each individually identified component, ensuring precise accuracy and repeatability. TSK advanced precision engineering and efficient unit design help reduce cycle times and cost per component. The machine incorporates a 500 super-efficient piezo-electric device to precisely scribe and dice the work piece. High-quality crystals provide a longer durometer and greater production uniformity for repeatable scribes. The piezo-electric device also allows for faster output speeds and higher throughput, making it suitable for various high-volume applications. ACCRETECH AD 20T also offers advanced features such as multi-layer dicing, which allows for the separation of multiple layers without the use of lasers. It also offers an in-line inspection tool, enabling tracked pass/fail inspection of each component. This ensures the highest level of precision and quality control. The asset utilizes a simple graphical user interface, allowing for easy set up and training times. The open frame and modular architecture allow for flexible downtime operations and unique configurations. Additionally, the model is equipped with a wide range of printed circuit board manufacturing tools, which enables a wide variety of applications with minimal setup requirements. AD 20T is an automated scribing and dicing equipment designed for precision alignment and pattern-based device applications. Its high speed and energy efficiency make it ideal for cost-sensitive die attach, wire bond, encapsulate, solder paste, and bonding applications. Its open-frame design and modular architecture make it suitable for a wide range of applications. Combined with its wide range of printed circuit board manufacturing tools, ACCRETECH / TSK AD 20T is a powerful and reliable tool for any precision scribing and dicing needs.
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