Used ACCRETECH / TSK AWD-10A #101467 for sale

ACCRETECH / TSK AWD-10A is a scribing and dicing equipment. It is suitable for processing a variety of materials, such as wafers, glass and ceramic substrates, plastic foils, and fragile electronic parts. The system is composed of an automatic wafer loader, wafer handler, alignment table and machine vision unit. The automatic wafer loader aligns the wafer with a retaining ring, and is capable of handling up to 4" and 8" diameter wafers. It also utilizes a laser detection machine to correct the tilt angle of the wafer, to ensure smooth and accurate operation. The wafer handler is a large mechanical arm with a wafer clamp. It can move the wafer along the X, Y and Z axes to the desired position, and handle substrates with a maximum weight of 5 KG. The alignment table is equipped with an optical lens and a laser tool. It is used to measure the angle and position of the wafer, by precisely aligning the wafer with respect to the optical lens and laser asset. An LED spot light can also be used to facilitate the alignment process. The machine vision model is the core of TSK A-WD-10A, and is responsible for the actual dicing of the wafer. It comprises a camera, a scribe arm, and a dicer. The camera is used to detect the position of a wafer, and then control the scribe arm to trace a desired line on the wafer. The dicing blade is used to physically cut the wafer along the traced line. The operator can program the cutting patterns and thickness of the wafer in the dedicated software application. Depending on the cutting pattern, ACCRETECH A-WD-10 A can perform both straight and circular dicing, to produce a range of pieces with a uniform thickness. The equipment can process a wafer at a maximum speed of 400 mm/second and with a maximum acceleration of 0.3G. Finally, the system includes a dedicated cooling unit with water chillers, to ensure error-free performance at all times. Overall, TSK A-WD-10 A is a highly efficient scribing and dicing machine for a range of materials. Its automated wafer loader and wafer handler reduce the need for manual alignment, while a powerful machine vision tool ensures precision cutting. The asset is also capable of high-speed operation, and can be easily programmed for cutting patterns, making it an ideal choice for efficient and accurate processing of materials.