Used ACCRETECH / TSK AWD-10A #9241466 for sale

ACCRETECH / TSK AWD-10A is a "scribing/dicing" system that is commonly used for wafer-level packaging applications. It offers a comprehensive solution, allowing for the precise cutting, or "scribing," and dicing of a variety of wafer substrates from fragile materials such as aluminum and glass to silicon and ceramics. TSK A-WD-10A is a fully integrated system comprised of an automated vacuum chuck, powered wafer delivery, dust-free housing, and a variety of laser source options. The automated vacuum chuck securely holds each wafer while the powered wafer delivery moves it into the cutting chamber. The dust-free housing prevents any contamination from entering the system, while the laser source options provide a range of adjustable cutting parameters. ACCRETECH A-WD-10 A features an adjustable number of scribe points and timing, as well as precision movements for quick wafer positioning. It also provides excellent repeatability, with submicron accuracy, and can process wafers up to 8" in diameter. The included software provides an easy to use interface, which allows for data input, editing, and initialization of individual jobs. AWD-10A also features a variety of safety features such as the automatic laser shut-off and password access control. ACCRETECH / TSK A-WD-10 A is designed and built to optimize both performance and user safety during operation. TSK A-WD-10 A is a powerful tool perfect for the efficient and precise cutting and handling of wafers and other delicate substrates. The adjustable control features and lightweight, efficient design make this machine ideal for a variety of packaging applications. It also provides excellent repeatability and user-friendly operation.