Used ACCRETECH / TSK AWD-200T #9067106 for sale

ACCRETECH / TSK AWD-200T is a scribing / dicing equipment that is used for high precision cutting and scribing of brittle materials in the electronics component and semiconductor industries. The system utilizes advanced laser beam processing technology and high-precision laser beam scanning for cutting and scribing precision thin-film electronic components. It can be used for cutting and scribing various materials such as ceramics, silicon wafers, aluminum nitride, glass, sensory elements, IC chips, etc. TSK AWD 200 T offers a complete, easy-to-use unit that includes all the necessary tools for processing the desired material. The laser beam processing machine includes a laser source, a specialized beam scanning and controlling tool, and a scribing / dicing device. The laser source is responsible for generating the laser beam, which is then guided towards the scribing / dicing device and focused onto the workpiece. The specialized beam scanning and controlling asset is responsible for handling the beam deflection and positioning to accurately focus the laser beam on the targeted workpiece while ensuring its accuracy. The scribing / dicing device can be adjusted to the desired cutting or scribing speed and the laser beam can be moved in the x, y, and z axes. The laser beam can also be adjusted to enable higher speeds when needed. ACCRETECH A-WD-200T offers the capability to adjust the beam in order to produce different scribing patterns. This allows for greater control and flexibility when producing complex designs. The device also includes two motorized linear axes that ensure even distribution of the laser beam across the workpiece. The model is capable of scribing lines at very small intervals and at high resolution. The scribing / dicing device can cut depths from 0.03mm to 0.8mm. Furthermore, ACCRETECH / TSK A-WD-200T utilizes a vacuum for extracting dust generated during the scribing or dicing process. This dust extraction feature prevents contamination and protects the laser optics from damage. Overall, ACCRETECH / TSK AWD 200 T is an effective and reliable equipment for high-precision scribing / dicing of brittle materials. The device offers highly accurate scribing and cutting capabilities and is designed for long-term use. Its advanced laser technology allows for greater control and flexibility when producing complex designs. The dust extraction feature prevents contamination and protects the laser optics from damage. With its high processing accuracy, ACCRETECH AWD-200T is ideal for use in the electronics component and semiconductor industries.