Used ACCRETECH / TSK AWD-200T #9101283 for sale

ACCRETECH / TSK AWD-200T is a scribing and dicing equipment designed for slicing and milling of semiconductor wafers and other thin materials. It is capable of accurately slicing wafers with a minimum of force and without causing any damage to the material. TSK AWD 200 T comes with a high precision, high productivity X-Y precision scribing head which can be programmed for precise movements. The system is also equipped with a double zoom laser displacement sensor that ensures optimal accuracy and repeatability. ACCRETECH A-WD-200T is designed to provide a high speed and high precision operation that can reduce operation time and improve overall efficiency. This unit can be used in either a single stage or a multiple stage operations. The single stage operation is used for cutting large areas such as wafer edges and the multiple stage operation is for dicing the wafer into small pieces. AWD-200T is user-friendly and offers reliable accuracy with various scribing sorting methods. The machine is controlled by a joystick that allows operators to easily control the x and y axis. It is also equipped with a 24-bit color LCD monitor that displays all the parameters for the machine. TSK A-WD-200T is also able to save up to 10 programs for later use, allowing users to quickly recall program settings. TSK AWD-200T provides a very high accuracy of ±0.02mm in the x and y axis. This is achieved by the use of a high precision stage industrial servo motor with encoder feedback. This motor is capable of accurately controlling the x-y axis velocity and acceleration movements. The tool also has an optional Automatic Wafer Loader which can be used to load wafers without manual intervention, significantly improving overall efficiency. The asset can be used for cutting a variety of materials including ceramic, glass, plastic and the like. It is also capable of handling a wide variety of materials thickness from 0.2mm up to 6mm. ACCRETECH / TSK A-WD-200T also comes with various optional accessories such as a double check laser and a thin film laser. The double check laser is used for checking the scribing condition while the thin film laser is used for measuring material thickness. In conclusion, ACCRETECH / TSK AWD 200 T is a high-precision, high-speed scribing and dicing model designed for slicing and milling of semiconductor wafers and other thin materials. Its user-friendly design ensures accurate performance and optimal efficiency. It is capable of handling a variety of materials thickness, and its optional accessories make the equipment even more versatile. The system comes with a 24-bit color LCD monitor and up to 10 programs can be saved for later use, significantly improving overall productivity.