Used ACCRETECH / TSK AWD-200T #9251481 for sale

ACCRETECH / TSK AWD-200T
ID: 9251481
Vintage: 2007
Dicing saw 2007 vintage.
ACCRETECH / TSK AWD-200T is a scribing / dicing equipment developed to meet the needs of the semiconductor industry. The system includes a scribing control unit, a dicing saw unit, and all necessary parts for the setup and operation of the unit as a single unit. TSK AWD 200 T machine is designed for high precision processing of wafers and other substrates using a diamond scriber and dicing saw. The tool features a high power laser oscillator and cooling unit which enable it to meet the scribing and dicing needs of the most demanding production processes. The laser can be precisely adjusted for optimal focus and tension thanks to a unique "Laser Positioning Asset". This ensures that accurate scribes and shallow groove cuts are achieved. ACCRETECH A-WD-200T also features a manual wafer stage as well as an integrated, automated wafer stage model. This allows users to work with both manual and automated processes. The automated stage equipment features an innovative "Load&Go" system allowing complete wafers to be loaded quickly and efficiently. This unit also allows for quick and precise scribing and dicing with minimal downtime and increased throughput. ACCRETECH AWD-200T machine also features precise positioning of the scribing head and the dicing saw via the integrated "Positioning Tool". This asset also includes a "Generational Positioning" technology that allows wafers to be placed with a high degree of accuracy. This ensures that the groove positions are precisely positioned to achieve the desired scribe lines and dicing patterns. A-WD-200T is also designed for maximum safety and user convenience. It features interlocks for both scribing and dicing, along with comprehensive built-in safety and operating instructions. It is equipped with an air filter, vacuum exhaust and a debris filter to ensure that particles are eliminated from the work area. Finally, the model also has sound-dampening features, allowing the equipment to be used even in noisy working environments. In conclusion, ACCRETECH / TSK A-WD-200T is an advanced scribing and dicing system designed for use in high-precision applications. Thanks to its innovative features, including its Laser Positioning Unit, automated wafer stage machine, and "Generational Positioning" technology, it is capable of meeting the demanding production requirements of today's semiconductor industry.
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