Used ACCRETECH / TSK AWD-200T #9412310 for sale

ACCRETECH / TSK AWD-200T is an automated wafer dicing and scribing equipment designed for processing single substrate die separations. The system's ability to process multiple types of die sizes on the same substrate makes it ideal for cost-effective volume production of memory, logic, and MEMS devices. TSK AWD 200 T integrates high-precision proprietary scribing and dicing techniques with advanced cutting technologies to ensure optimal edge quality and die accuracy. The unit's versatile, robust design makes it suitable for both standard and advanced process requirements. ACCRETECH A-WD-200T machine is based around a high accuracy scribing stage featuring a high resolution linear scale for precise positioning. The scribing stage is equipped with a backside auto-alignment tool, allowing for rapid setup and precise and accurate scribing of smaller die sizes. The asset is also outfitted with an adjustable height and magnification level model, which provides precise control over the scribing operations. TSK A-WD-200T uses a high-speed, high-resolution dicing stage, offering precise positioning and rapid die separation. This device utilizes a high-speed dicing head for the precise and accurate separation of die without damaging or disrupting the edge quality of the die. This machine also features a rotating stage that allows for the precise orientation of the die relative to the dicing blade, providing precise die margin control. ACCRETECH AWD 200 T is also equipped with advanced safety systems to protect the entire equipment from damaging or damaging vehicles. The system is also equipped with a perimeter safeguarding unit that allows for maximum performance during the entire process. Lastly, the machine offers full traceability, enabling users to track data through the entire process. In summary, ACCRETECH / TSK AWD 200 T is a high-precision automated dicing and scribing tool that provides an ideal solution for efficient volume production of memory, logic, and MEMS devices. This machine is equipped with advanced technologies to ensure accurate scribing and dicing operations with precise die margins, as well as robust safety features for maximum efficiency and user protection.