Used ACCRETECH / TSK AWD-208T #9101295 for sale

ACCRETECH / TSK AWD-208T is a scribing/dicing equipment designed to provide accurate and precise separation of materials into thin sheets, slices, pellets, and particles. The system has a separation speed of up to 800mm/sec with a partition spacing ranging from 1.0 microns to 10µm. It is equipped with a planar optical detection unit to provide accuracy and precision for separation. The high scanning rate of the machine makes it extremely efficient and allows for an automated process for precision control of particles. The tool is designed for use with semiconductor and photovoltaic wafers. Its 2-dimensional planar linear vibration asset is capable of scanning wafers at a constant speed. The model provides a high-resolution output that helps to ensure reliable and precise dicing of materials. The scribing/dicing tool is equipped with a powerful software package that allows for the customization of the cutting parameters. The software can be used to program the equipment to perform several different cutting procedures and use algorithms for optimal separation. The high-speed motion control system allowed by the software ensures the accurate and precision-controlled separation of the wafer materials. The unit also includes a safety interlock machine to protect the user and the tool. It allows the machine to be operated only when the protective cover is securely locked and all other safety requirements are met. Additionally, the asset is provided with a digital controller to enable precision control over the cutting process. TSK AWD-208T provides an effective scribing/dicing solution that can improve wafer production efficiency and reduce wastage. The model is an essential tool for the semiconductor, photovoltaic, and wafer industries and can help organizations achieve higher yields with less waste.