Used ACCRETECH / TSK AWD-208T #9165922 for sale

ACCRETECH / TSK AWD-208T is a precision dicing and scribing equipment which is designed to produce superior quality die-pads, bumps, and via-hole surfaces. This system is capable of working with a variety of materials including silicon wafers, glass panels, MEMS and NEMS. TSK AWD-208T is a full automation, high-speed production unit which is capable of processing up to 100 wafers per hour with up to 8 simultaneous scribing lines. It features a 6-axis articulating manipulator which provides precision 3-axis, 5-axis, and 7-axis motion for efficient scribing, etc. and a 0.01µm dicing accuracy. The machine features a high-performance spindle motor and a vacuum-based loading tool for loading and unloading of wafers. The wafer chucking asset is designed for precision and repeatability with its high-force locator and alignment pins. The model also features a Position Assisted Passby scribing method which enable improved scribing speed and precision half-diced scribe lines up to 0.4 mm wide. ACCRETECH A-WD-208T also features a unique built-in vision camera equipment which helps to align and measure wafer positions. In addition, a sample segment alignment mode enables the system to align die pads and scribes. In addition, TSK A-WD-208T is equipped with safety features including a high-capacity dust filter for the collecting of the diced material, a 20V class 3 power supply for secure data protection, and an emergency power off unit which disables the machine in case of an emergency. ACCRETECH / TSK A-WD-208T is a user friendly production tool that is designed to provide maximum throughput and reliable performance. With its advanced features and safety features, this asset is the ideal choice for production environments that require high accuracy, high speed, and precise processing.