Used ACCRETECH / TSK AWD-208T #9217222 for sale

ACCRETECH / TSK AWD-208T is a 'scribing/dicing' equipment designed to perform a wide variety of wafer handling and scribing/dicing operations with high accuracy and maximum throughput. Its compact size makes it suitable for a single-bench operation and its advanced air-bearing spindle design allows it to have high stability and vibration-free operation. With its high-precision drive system and powerful programming functions, TSK AWD-208T works efficiently and accurately on a variety of materials. The unit is equipped with a linear encoder as standard equipment for precise positioning of the wafer. ACCRETECH A-WD-208T features two motors, one for the main spindle and the other for the tilting frame. In addition, the machine is fitted with a six-way positioner for 6-axis scribing and dicing operations, allowing for easy adjustment of angles and depths. It also features thermal compensation to prevent thermal drift, allowing for high-precision cutting with minimal variation. ACCRETECH / TSK A-WD-208T's cutting capacity is among the best in its class. It supports a wide variety of materials, including hard-to-process materials, such as metals, ceramics, printed circuit boards, and glass. For these materials, the tool features a high-speed chip removal asset to minimize damage and optimize the cutting process. TSK A-WD-208T is compatible with coated blades to extend the life of blades in high-speed cutting. A-WD-208T also features intelligent self-diagnostics for monitoring and troubleshooting the model. This includes capturing and saving real-time performance data, error logs and set-up parameters. Allowing technicians to easily review and diagnose problems, preventing downtime and increasing productivity. AWD-208T is a sophisticated equipment that is designed for easy operation and integration to fit into an existing production line. With its low-noise operation, programmable remote control, and CNC/PC interface, ACCRETECH AWD-208T is the perfect fit for high-precision, high-performance wafer handling and scribing/dicing operations. Its advanced technology and versatility make it the perfect solution for high-volume processing for customers looking for consistent and high-quality results.