Used ACCRETECH / TSK AWD-208T #9233558 for sale

ACCRETECH / TSK AWD-208T Scribing / Dicing Equipment is an advanced and highly precise method of fine-pitch dicing for sensitive wafers within the electronics industry. It utilizes a combination of lasers and optics to perform highly precise separation of small components from the substrate. The system is composed of three interlocking components - the main housing unit, the base chassis, and the carrier plate. The main housing unit is constructed out of a durable and corrosion-resistant material, such as stainless steel or aluminium. It houses all of the unit's core components, including the laser dicing head, the motors for movement of the panels, and the optics for alignment of the laser and the substrate. The base chassis is responsible for providing the machine's overall motion control. It works by controlling the X-Y axes of the panel, the rotational speed of the scribing head, as well as acceleration and deceleration. It also houses the laser head and focuses the beam output onto the substrate by adjusting power and beam motion accordingly. The carrier plate is responsible for supporting the wafer and providing separation along with the lasers' pulses. It is important for the wafers to remain completely motionless while the laser tool is in operation. The carrier plate is composed of a sturdy material which will not deform and ensures that the substrate remains flat. The asset also features a guidance model, which makes sure that the laser remains at a precise and consistent distance from the substrate, ensuring that the scribing process remains accurate. Additionally, the guidance equipment includes an array of sensors which monitor the substrate for any vibration. The guidance system also includes an advanced computer control unit, which monitors the acceleration, deceleration, and pulse lengths of the laser machine. TSK AWD-208T Scribing / Dicing Tool is a powerful and reliable tool that is used in the production of various electronic components. Its precision and technological advancement make it an invaluable tool in fine-pitch dicing for sensitive wafers in the electronics industry. It is one of the few scribing and dicing systems that offer a high level of accuracy and ensures that scribing is performed with great accuracy.