Used ACCRETECH / TSK AWD-208T #9394981 for sale

ACCRETECH / TSK AWD-208T is a sophisticated scribing and dicing equipment developed for use in semiconductor fabrication. It is a highly precise system that can be used to scribe, dice, strip, and etch wafers quickly and precisely. The unit comes with two optional stages: alignment stage and dicing stage. The alignment stage on TSK AWD-208T has a high-precision x/y stage with an accuracy of 0.1 microns, which enables it to accurately position and align wafers prior to scribing. The machine also comes with an innovative vision tool with high resolution, enabling it to locate and identify individual die. The vision asset is also equipped with high-speed, automated focus and pattern recognition algorithms, allowing ACCRETECH A-WD-208T to work quickly and efficiently. The dicing stage has a highly precise multi-axis cutting head, which can automatically adjust its speed and feed rate in order to optimize the cutting speed and accuracy. It can also perform multi-pass scribing, allowing multiple wafers to be processed in one go. This stage also has a powerful laser, which is used to strip and etch die. The laser is equipped with a cleaning head, which sweeps away debris after a cutting cycle is complete. Overall, ACCRETECH AWD-208T is a powerful and precise scribing and dicing model, ideal for semiconductor and electronics fabrication. Its high accuracy, speed, and automated features make it an excellent choice for those looking to quickly and accurately produce high-quality electronic components. Its powerful laser can even be combined with special software to etch, strip, and label die in one step. With its optional stages, AWD-208T is a comprehensive, all-in-one solution for scribing and dicing needs.