Used ACCRETECH / TSK AWD-250S #9357329 for sale

ACCRETECH / TSK AWD-250S is a high-precision scribing and dicing equipment for the fabrication of thin films and wafers. The system uses an advanced, ultra-high-resolution laser beam scanning head to scribe delicate patterns on the top surfaces of thin films and wafers. The unit is capable of scribing patterns with the highest accuracy, precision, and repeatability. TSK AWD-250S is equipped with a software interface and a real-time monitoring machine to ensure accuracy and reliability of the scribing process. It also includes an automated scribing/dicing algorithm that allows users to program the shape, size, and depth of the patterns to be scribed. This enables greater flexibility and accuracy in creating intricate patterns on wafers, critical in a number cutting-edge applications including semiconductor device fabrication. ACCRETECH AWD-250S is designed for use in a production environment, offering reliable operation in even the most demanding manufacturing environments. In addition, the tool includes wafer handling and placement stages, as well as thermal shock avoidance to prevent risk of damage to the wafer. The asset is designed to scribe patterns up to 270µm in width with a repeatability of 0.2µm or better, and achieves sub-micron spot jitter accuracy of 4µm or better. It is compatible with a wide range of materials such as semiconductors, insulators, and metal foils. AWD-250S is equipped with a powerful motor to provide exceptional acceleration and speed. The model supports speedy and precise wafer scribing at up to 9m/second (30fps) maximum speed. ACCRETECH / TSK AWD-250S is suitable for applications requiring high throughput as well as those requiring a high level of accuracy. The equipment is supported by a comprehensive suite of software applications, which provide support for enhanced process control, job programming, job monitoring, and data management. This enables comprehensive control and efficient operation of the system. TSK AWD-250S is a versatile and capable scribing and dicing unit. With its advanced features, consistent performance, and quality output, the machine is ideal for top-level fabrication working with thin films and wafers.