Used ACCRETECH / TSK AWD-300T #293607243 for sale

ACCRETECH / TSK AWD-300T is an advanced scribing and dicing equipment (or AWD) designed to meet the exacting demands of modern semiconductor wafer processing. TSK AWD 300T provides ultra-precise dicing results and top-level performance with an enhanced multi-axis system. At the heart of ACCRETECH A-WD 300T is a combination of advanced mechanical and electronic components. This includes a linear motorized stage, an 11-axis motorized stage and a laser scanning stage to ensure ultra-precise alignment of the laser. The entire unit is then housed in a class 10,000 cleanroom-enhanced cabinet for maximum reliability and component protection. ACCRETECH AWD 300T offers a wide range of scribing and dicing capabilities. Fine lines - down to 10 microns in width - can be scribed directly onto wafers, while ACCRETECH / TSK A WD 300 T's advanced autofocus examines the wafer surface to ensure the optimal focus is maintained. Both destructive and non-destructive dicing functions are also available, with the machine capable of handling up to 300mm wafer sizes. TSK A-WD 300T also offers a range of automation options, including the ability to integrate other equipment into the tool for a complete automated production line. The asset's inbuilt high-speed laser analysis tools provide accurate and repeatable performance with the ability to quickly analyze the wafer topography and wafer thickness with precision. A-WD 300T is designed to meet the increasing demand for higher accuracy and improved reliability from the semiconductor wafer processing industry. The advanced multi-axis model and class 10,000 cleanroom-enhanced cabinet offer the highest level of precision, while the range of automation options provide an optimal solution for automated production lines. Together, these features make TSK AWD 300 T an ideal choice for production facilities requiring the highest quality of performance.