Used ACCRETECH / TSK AWD-300T #9315882 for sale
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ACCRETECH / TSK AWD-300T is a high-precision scribing and dicing equipment. Designed for use in the manufacturing of semi-conductor wafer substrates, it can accurately scribe and dice up to 300 mm in diameter wafers with thicknesses ranging from 1mm - 4mm. The system is highly accurate and repeatable, enabling users to consistently obtain specified cuts with minimal waste material. TSK AWD 300T is a fully automated unit, with the user interface allowing for simple operation. It utilizes an advanced multi-axis, servo-control stage and a high-precision multi-axis motorized scribing tool to achieve optimized results. The machine comes with a number of advanced features, such as a real-time programmable feed rate, a high-speed autofocus vision tool, a cutting-edge chip recognition asset, and a powerful data collection option. ACCRETECH A-WD 300T can achieve fast cycle times and minimal waste by utilizing its sophisticated scribing technology. The model is equipped with an optical CCD camera to monitor blade performance and detect any chips or micro-fingers on the wafer to ensure accurate scribing. The equipment also comes with an advanced sensor system to monitor vibration of the tool head and enabling fine adjustment if required. ACCRETECH / TSK AWD 300 T is designed with a high focus on performance, safety, and operator comfort. It follows stringent safety protocols for operation, such as a safety stop and emergency foot switch operation and has a robust construction made of alloys and stainless steel to ensure maximum durability. The user interface is easy to use and allows users to quickly enter program information. Additionally, the unit utilizes a quiet, energy-saving operation, as it is capable of running on low-voltage (100/110V AC) power. In conclusion, ACCRETECH AWD 300T is a high-precision scribing and dicing machine that is designed for use in the manufacture of semi-conductor wafer substrates. It has an array of advanced features, such as a real-time programmable feed rate and a high-speed autofocus vision tool, and can accurately and reliably scribe and dice up to 300 mm in diameter wafers. It is designed with safety and operator comfort in mind and has a quiet, energy-saving operation.
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