Used ACCRETECH / TSK AWD-300T #9382971 for sale

ACCRETECH / TSK AWD-300T is a high-precision scribing / dicing equipment designed for semiconductor production. It features a robust three-axis servo-controlled motion architecture, providing high-speed cutting and dicing of semiconductor wafers with maximum precision. The system is equipped with a X-Y precision CMM table which is accurately driven by a precision ballscrew, providing a work envelope of up to 300 mm in X and Y directions. The Z-axis is provided by a high-accuracy servo-motor, providing precise step movement of the spindle collet in up to 8 μm increments. The built-in programmable laser displacement and range-sensing unit ensures minimum cutting oscillations, while providing improved accuracy and repeatability. TSK AWD 300T Machine combines high speed spindle with high acceleration drive and low inertial encoder control technology. Its spindle speed is adjustable up to 5.000 rpm, and torque is up to 0.6 Nm, enabling high-speed and effective cutting of fine-grain materials such as semiconductor wafers. The tool is designed to provide nanometer accuracy on X-Y-Z directions, with the X and Y repeatability up to 3 μm, and repeatability of Z-axis up to 2 - 3 μm. ACCRETECH A-WD 300T also includes a dedicated (optionally available) chiller unit. It provides reliable cooling during wafer processing, ensuring low thermal drift and consistent temperature in the working environment. The asset software allows the user to control the two-way I/O, and to assign a number of parameters such as motor speed, depth, and cutting time. In conclusion, TSK AWD-300T is a high-precision scribing / dicing model, designed specifically for semiconductor production. It offers a robust three-axis servo-controlled motion architecture, high-speed cutting, and nanometer accuracy. The equipment is equipped with a dedicated (optional) chiller unit and dedicated software, allowing easy control of a number of parameters, making it an attractive option for anyone looking for precise and reliable wafer scribing and dicing.