Used ACCRETECH / TSK AWD-300TX #9240794 for sale

ACCRETECH / TSK AWD-300TX
ID: 9240794
Dicing saw.
ACCRETECH / TSK AWD-300TX scribing and dicing equipment is a precision die attach equipment for mounting and cutting dies into a substrate (which is usually semiconductor wafer materials). It uses a patent-pending Pro-Wet Scribing technology, with a unique vibration-absorbent air-bearing spindle, for accurate and repeatable scribing and clicking. The system allows the user to handle die sizes, fromS200x200mm to more than 500x500mm. The Pro-Wet scribing technology features an integrated material-specific wetting agent, which allows the user to precisely isolate individual dies from the wafer. Using the Pro-Wet unit in combination with TSK patented air bearing spindle, extremely precise and repeatable scribing and dicing can be achieved. The Pro-Wet machine also features high resolution imaging, which enables the user to effectively adjust die size, shape, and position. TSK AWD-300TX has a large working area, which allows for the attachment of various mounting substrates. The unit features a 200x200mm gravity die plate, 5-axis programmable motion tool and a positioning accuracy of ±5µm, allowing for precise and repeatable die attaching. ACCRETECH A-WD-300TX also utilizes a high-speed cutting blade, with speeds of up to 12,000 rpm, and is capable of slicing through various materials, such as PET, PI, Polyimide, and silicone. TSK A-WD-300TX is an all-in-one package, capable of robotic handling, die attaching, and cutting. The entire asset is contained in a single cabinet and is designed to fit in a variety of tight spaces. The machine is also compatible with a variety of software programs, offering features such as auto-alignment of dies, automatic detection of shorts, and die-sizing features. ACCRETECH AWD-300TX is a highly reliable, safe, and efficient scribing and dicing model perfect for high-volume production lines. The equipment can be used for a variety of applications, such as the production of memory modules, display screens, and power semiconductor devices. The all-in-one system offers excellent and consistent performance, making it a great option for a variety of die-attach and dicing operations.
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