Used ACCRETECH / TSK AWD-300TX #9362185 for sale

ACCRETECH / TSK AWD-300TX is a scribing and dicing equipment designed to provide precise and high-speed, non-contact processing of wafers in a variety of materials. The machine has a non-contact laser cutting head which uses infrared laser radiation to scribe the required line patterns into the wafer surface. The scribing and dicing process is initiated when the laser beam passes through the XY stages to trace the pattern directly onto the wafer. The scribing machine also incorporates a CCD camera and image processor to ensure that the pattern is correctly captured and aligned. The image is then verified using comparison software to ensure accuracy of the designed pattern. In addition, TSK AWD-300TX includes a high-precision, high-speed die transponder with a resolution of 0.25μm and a die selectivity of 6μm. This enables the scribing and dicing machine to accurately and precisely cut the wafer into the desired shape and size. The machine is also equipped with an automatic vision system that further ensures the accuracy of the wafer cutting. ACCRETECH A-WD-300TX is a highly reliable and efficient machine, with a maximum scribing speed of 2200mm/sec, accuracy of 0.03mm, and repeatability of ±0.05mm. The machine can be used for thin film substrates, chip-on-film substrates and glass substrates. It is capable of handling wafers with thickness up to 0.5mm. The machine is also able to handle large substrates up to 300mm in diameter. For easier and more efficient operation, the machine is built with a user-friendly interface. The unit also allows the user to quickly and easily set cutting parameters and perform real-time quality control. TSK A-WD-300TX also includes a variety of safety features such as failsafe protection and automatic shutoff. To conclude, ACCRETECH AWD-300TX is a reliable and robust scribing and dicing machine that provides precision and high-speed non-contact processing of various wafer materials. It features an automated transponder, vision tool, and user-friendly interface, as well as a range of safety features. It is suitable for various substrates of varying thickness, and it enables quick and efficient scribe and dice operation.