Used ACCRETECH / TSK AWD-5000A #293605142 for sale

ACCRETECH / TSK AWD-5000A is a high-performance scribing and dicing equipment. It is designed for precision wafer processing, providing a high-speed, accurate and reliable solution for scribing and dicing of semiconductor wafers. TSK AWD 5000A offers the highest degree of accuracy and precision available in scribing and dicing systems, enabling it to facilitate complex processes that require high levels of performance. ACCRETECH A-WD-5000A system consists of a high speed scriber, featuring a moving platform that holds the wafer in place and an integrated X-Y axis motion unit that ensures accurate positioning and alignment of the scriber spindle with the material being processed. The machine is equipped with a high-power laser that processes the wafer with a high-precision cut. The laser's proprietary control tool ensures accuracy, uniformity and repeatability of the cuts. TSK AWD 5000 A asset also includes a high-speed automatic dicing unit which is capable of rapidly and accurately dividing wafers into individual die. This unit employs an ultra-fast Vision Model that pinpoints die locations on the wafer so that they can be precisely cut. AWD 5000A also features a wafer mounter, which securely clamps the wafer onto a special base to keep the wafer stationary during cutting and dicing operations. The mounter also uses a microscope to visually inspect the wafer for accuracy and uniformity of cut. ACCRETECH / TSK AWD 5000 A is equipped with a highly advanced and user-friendly control interface. The user interface allows for full monitoring of the process, enabling sophisticated scanning for defects and providing useful feedback for the user. Additionally, the equipment offers a range of preset cutting parameters, making it easy to select the appropriate cutting parameters for any given task. Moreover, ACCRETECH AWD-5000A can be used in a fully automated fashion, allowing high volumes of wafers to be processed quickly and accurately. ACCRETECH A-WD-5000 A is a powerful and reliable system that provides the highest level of accuracy in scribing and dicing of semiconductor wafers. Its advanced control interface and automated processes make it an ideal solution for any precision wafer processing application.