Used ACCRETECH / TSK AWD-5000A #9239035 for sale

ACCRETECH / TSK AWD-5000A is a next-generation scribing and dicing equipment designed for efficient processing of large and thin wafers. It is a highly accurate and powerful dry cutting process that can be used on a variety of materials, including semiconductor, LED, display, and other substrates. The core of this system is its advanced scribing tool head, integrated with a multi-axis Robot arm, making total process automation and precision cutting achievable. The optimized robot arm offers a vibration-free motion profile that eliminates disturbance ensuring high positional accuracy without any external influence. This tool head is integrated with a high-end automated cutting process with two cutting heads, allowing for two-sided parallel cutting of the wafer. The head is also equipped with an LED laser light-source to provide a precise line of scribing on the material for cutting. The unit has an advanced built-in spindle drive and monitoring machine, which keeps speed and pressure monitoring precise and efficient for exact and repeatable performance. The Robot arm has adjustable pitch settings and encoder measurements to ensure that the scribe accuracy is maintained. TSK AWD 5000A has an automatic loading tool, allowing for up to four wafers to be loaded into the equipment at once. This makes the loading of wafers into the cutting asset quick and easy. Moreover, the model features an intelligent user interface that makes the manipulation of processing parameters easy. It also provides real-time feedback for cutting efficiency, position accuracy, and other process-related information. It has an ISO 1300-2 compliant user password and login that ensure user security and access rights. For maintenance, the equipment is equipped with an automatic maintenance software that identifies any deviations and alerts the user. This feature can detect performance issues and other irregularities and take corrective action accordingly. Overall, ACCRETECH A-WD-5000A is a highly advanced system for efficient and accurate scribing and dicing. Its integrated Robot arm and advanced cutting head ensure precision cuts, while its automated wafer loading mechanism maximize throughput and reduce downtime. Its intelligent user interface and built-in maintenance software make the unit an attractive choice for those requiring high performance scribing and dicing capabilities.