Used ACCRETECH / TSK AWD-5000A #9239036 for sale

ACCRETECH / TSK AWD-5000A is a high-precision scribing/dicing equipment that supports wafer scribing and dicing operations for various types of materials, including ceramic, sapphire, and SiC wafers. TSK AWD 5000A is also ideal for manufacturing of devices such as GaAs ICs, laser diodes, LED chips, and laser diodes. ACCRETECH A-WD-5000A features a compact design with a small footprint, a low operating cost and minimal maintenance requirements. The system has a highly accurate aligning head for precision scribing and dicing with a repeatability of 0.002mm. The unit has a high-power air bearing spindle which is capable of scribing and cutting at heights of up to 6mm. It has a wide processing area which can accommodate wafers up to 10"x10". The spindle rotation speed can go up to 20000rpm for enhanced cutting efficiency and consistent cutting performance. TSK A WD 5000 A utilizes a twin camera machine to ensure precise alignment of the wafer for scribing and dicing operations. It has a 6.5" LCD display which shows the cut pattern and allows for user adjustment of the cutting path. The tool also features built-in algorithms and software that can automatically identify wafer corners and edges to optimize the scribing and dicing process. ACCRETECH AWD 5000A has a variety of safety features, including an emergency stop switch and a blade guard which cover the blade during cutting operations. Additionally, the asset also features a wide range of additional features such as programmable parameters, a vision microscope, and laser marking. Overall, A WD 5000 A is a powerful, reliable, and user-friendly scribing/dicing model that can support a wide range of applications. The equipment offers superior precision, reliable accuracy, and high cutting speeds for efficient wafer processing.