Used ACCRETECH / TSK ML 300 Plus-II #9379462 for sale

ACCRETECH / TSK ML 300 Plus-II is a diamond scribing and dicing equipment combining the latest in cutting-edge semiconductor slicing technology with easy to use automated operation. Developed to provide the highest precision in delicate slicing and dicing tasks, the system is designed specifically for semiconductor package singulation, providing optimal dicing performance at outstanding speeds. TSK ML 300 Plus-II utilizes a patented diamond-blade-free scribing set-up, which features the highest degree of efficiency and accuracy in cutting and scribing hard materials such as silicon, sapphire, and diamond. This allows for a cutting tolerance of +- 10 ㎛ accuracy, which is unmatched in the industry. The machine is also designed to have the highest throughput, allowing for simultaneous cutting and scribing of up to four wafers at a time. ACCRETECH ML 300 Plus-II is equipped with TSK own ACCRETECH Perfect Control servo motors, providing the highest precision in the industry with response rates of up to 150KHz. ML 300 Plus-II also features best-in-class safety controls and monitoring systems. An integrated vacuum management unit monitors vacuum levels within the housing and drawers constantly, ensuring that the blades are securely held in place with even pressure and torque. Additionally, a high-efficiency air filter machine keeps dust particles and other debris to a minimum. The self-diagnostic tool of ACCRETECH / TSK ML 300 Plus-II provides quick and easy maintenance, with an on-board AI chip to search through any potential operating errors and recommend the solution accordingly. Additionally, the machine's intuitive GUI allows users to quickly and easily set up processes. In short, TSK ML 300 Plus-II provides unsurpassed performance in terms of accuracy, speed, maintenance, and safety, ensuring that users can handle any production needs with confidence and convenience.