Used ACCRETECH / TSK ML 300 Plus-WH #293619501 for sale

ACCRETECH / TSK ML 300 Plus-WH provides an innovative and reliable solution for the precision machining of semiconductor chips. It is designed specifically for the safe and accurate scribing and dicing of wafers and silicon chips. The equipment features a robust and highly reliable design that ensures its performance in harsh operating conditions. It utilises two key technologies to provide a safe and effective cutting edge - the patented laser laser scribe technique as well as the slotted edge scribe technique. Both techniques provide a repeatable process, allowing for exact positioning of scribe paths. TSK ML 300 Plus-WH includes a powerful gas assist system to ensure a smooth and uniform cut. This is driven by a high-pressure air-bearing that has been optimised to ensure maximum precision. The unit also features a high speed, digital servo motor that provides an easy way to adjust the speed of cutting. To assist with this, the machine also comes with a manual control button that allows for easy adjustment of the cutting speed. The active turret has been designed to rotate the tool holder at varying speeds and in multiple directions. This helps to ensure that the correct cutting angle and the correct pressure can be applied during the cutting process. The tool also provides a range of options for wafer taper so that the cutting process is always exact and exacting. ACCRETECH ML 300 Plus-WH is equipped with advanced safety features, including an integrated safety cover on the cutting head and a dust collection asset to ensure a safe workplace environment. These features are vital for the safety of personnel and other persons in the vicinity when working with wafers and chips. The model has been designed to provide a maximum yield in terms of chip size and chips-per-inch (CPI) while ensuring the highest possible quality. It is an excellent option for those looking to do precision machining of semiconductor chips.