Used ACCRETECH / TSK ML 300 #293616128 for sale

ACCRETECH / TSK ML 300 is a 'scribing/dicing' equipment designed to give semiconductor and other high precision industries an easily controlled and accurate cutting solution. Scribing and dicing are both processes that involve cutting or separating materials into smaller pieces. This system combines both methods into one package for efficient and reliable cutting. TSK ML 300 unit uses an advanced semi-automatic scribing/dicing machine, which has a computer-controlled laser cut head. The machine is mounted on a stable base and is operated with a touchscreen controller. It has a laser cutting area of up to 6.5" (165mm) and a travel area of up to 8" (200mm). This machine can cut through a variety of materials, including silicon wafers, ceramics, metals and plastics. ACCRETECH ML 300 has several cutting modes including scribe, dicing, milling, burn and groove. The scribing mode is used by semiconductor companies when they need to cut extremely small pieces or create micro cuts. This mode uses the laser cut head to provide a precise cutting action for delicate materials. The dicing mode is used for larger cuts and is highly accurate. This mode uses a blade to allow for the clean separation of parts and materials. The burn mode is used for materials that are difficult to cut and enables the machine to rapidly cut and create clean edges. The groove and milling modes are used for precision machining and edge finishing. ML 300 has a range of safety features that ensure safety during cutting. The machine has an emergency stop button, a manual cut override and a contact sensor tool. The contact sensor asset shuts down the machine in case the blade hits the surface of the workpiece, thus preventing damage to the workpiece and increasing safety. In addition, the machine has a range of adjustable settings including cutting speed, laser power and cut depth. Overall, ACCRETECH / TSK ML 300 is an advanced scribing/dicing model designed to provide accurate and efficient cutting for the semiconductor and high precision industries. The versatility of the machine and the range of cutting modes makes it an ideal choice for a variety of cutting tasks. The safety features ensure that the machine is easy to operate and reduce the risk of damage to the workpiece.