Used ACCRETECH / TSK ML 300FH #9355168 for sale

ACCRETECH / TSK ML 300FH is a state-of-the-art scribing / dicing equipment that is designed for precision wafer processing applications. It is a fully automated, all-in-one system that includes programmable die cutting, dual axis alignment, and scribing in one highly integrated platform. The unit is capable of accurately cutting and scribing different types of materials, including quartz and silicon, with high accuracy and speeds of up to 30mm per second. The machine operates using a combination of advanced robotic programming and powerful force sensing capability. This includes 3D motion positioning, die detection, and optical / tactile inspection. All these features contribute to a highly versatile and accurate tool that is suitable for precision wafer fabrication, slicing and scribing applications. The asset is based on a two-axis X and Y rail, on which the scribing and cutting heads are mounted. Additionally, the model is equipped with a set of two advanced, precision servomotors. These motors are responsible for providing a highly accurate and repeatable motion control, allowing for high-precision scribing and cutting operations. Additionally, the equipment also incorporates advanced motor control technology and software capabilities to ensure consistent production with minimal waste. The system's dual-axis configuration, together with the high-precision servomotors enables a wide range of applications, such as scribing and die cutting of quartz and silicon wafers. Additionally, the unit also includes several safety features to ensure its users' safety, including anti-crushing mechanisms and panic buttons. Overall, TSK ML 300FH is one of the most advanced scribing / cutting systems available today. It offers narrow frame width and reliable motion and safety systems that can easily handle a wide range of wafer scribing and cutting procedures. This makes it the ideal choice for many precision wafer fabrication applications, and a must-have for any laboratory or production environment that requires high-precision wafer cutting and scribing.