Used ACCRETECH / TSK SS 20 #293588080 for sale
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ID: 293588080
Vintage: 2013
Semi-automatic dicing saw, 8"
USB Port
Vacuum controller
Maximum work size, 8" / Workpiece 250x250 mm
Maximum number of frames, 12"
Spindle:
Rotation: 60,000 RPM
High-speed spindle: 80,000 RPM
High power spindle: 2.2 kW (30,000 RPM)
Maximum blade diameter: 60 mm to 80 mm
Rated output: 1.8 kW
X-Axis:
Cutting range: 260 mm
Maximum speed: 800 mm/sec
Y-Axis:
Cutting range: 260 mm
Maximum speed: 300 mm/sec
Accuracy: 0.002 mm / 260 mm
Z-Axis:
Stroke: 35 mm
Maximum speed: 80 mm/sec
Repeatability: 0.001 mm
Θ Axis:
Range of rotation: 380°
Air pressure: 0.55 to 0.7 MPa
Air consumption: 180 L/min (0.55 MPa)
Cutting water pressure: 0.3 to 0.5 MPa
Cutting water flow: 2.0 L/min
Cooling water pressure: 0.3 to 0.5 MPa
Cooling water flow: 1.9 L/min (0.3 MPa)
Exhaust: 5 m³/min
Power supply: 200-220 VAC, 4.0 kVA, 3-Phase
2013 vintage.
ACCRETECH / TSK SS20 is a state-of-the-art scribing and dicing equipment designed to meet modern day conversion requirements in the electronics, MEMS and semiconductor industry. This system excels in performing high quality slicing and scribing operations while realizing high throughput, high yield, and low residual stress. This unit is equipped with high precision linear motors which drive the saw and scriber heads independently. Furthermore, a unique thermal compensation machine maintain accuracy and stability even at high cutting speeds. The tool also offers variable-speed motor control with the cutting speed being adjustable by 5-500mm/s in order to accommodate for different materials. Apart from the scribing and dicing operation, TSK SS20 can also perform additional operations such as V-groove cutting, die-milling, and wafer lapping. The asset is also capable of automatically sorting the dicing/slicing parts into various categories according to size, depth, and orientation. In order to further maximize its functional potential, ACCRETECH SS20 comes with a wide range of accessories including an adjustable focus laser head, an end-effector, an internal air exhaustion unit, a chuck, a circular-blade wafer saw, a linear jet, a dust exhaust unit, and automated blades exchangers. SS20 is extremely versatile and can accommodate substrates of practically any shape and size up to 300mm in diameter. It is capable of operating with precision accuracy at a maximum pressure of 35MPa, making it one of the most reliable scribing and dicing systems in the industry. In addition, the model is compliant with international safety standards, such as IEC 61010, making it very safe to use. Its compact, ergonomic design also allows for easy installation, operation and maintenance, making it a great option for mass production lines. In short, ACCRETECH / TSK SS20 is an advanced scribing and dicing equipment capable of performing a wide range of operations with precision and efficiency. It is a great choice for high volume requirements.
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