Used ADT / K&S 7100 AD #9183980 for sale

ADT / K&S 7100 AD is a next-generation scribing and dicing solution designed for precision cutting of silicon, glass, and other materials. This advanced equipment enables users to cut materials to within 30 microns of accuracy while maintaining an exceptionally low-profile cutting head. The scribing system is suited for wafer and die sub-fabrication applications, and benefits from its simple and efficient design. ADT 7100 AD features both air- and water-cooled cutting heads, enabling it to efficiently create a variety of shapes from a wide range of materials, from hard substrates to soft ones. Its motor-driven positioning unit ensures precise cutting of features of any size and shape. The machine's dedicated power supply provides up to 10kV for cutting head operation, delivering maximum performance even at deep scales. Its scribing speed of up to 400 microns per second also ensures faster production of components for high-volume production runs. K&S 7100AD's design also makes it ideal for applications where accuracy is critical. Its variable scribing speed and hysteresis adjustments enable the tool to cut intimate details and complex shapes, while keeping power consumption and wear time to a minimum. Its optical autofocus drive ensures that each cut is replicated accurately and with minimal drift over time. ADT / K&S 7100AD also includes an automated die preparation mechanism. This ensures that all components are handled and cut precisely before being loaded into the production line. Its built-in camera asset monitors the cutting process to ensure accuracy, while allowing users to control the burn frequency for each cut. 7100AD is a well-engineered and reliable flexible scribing and dicing model for high-precision cutting. Its simple design, adjustable cutting parameters, and durable construction make it a reliable choice for a wide range of applications. With its exceptional precision and wide-ranging compatibility, 7100 AD is an ideal solution for high-volume, consistent wafer and die production.