Used ADT / K&S 7100 ProVectus #9112547 for sale

ADT / K&S 7100 ProVectus Scribing/Dicing Equipment is an automated solution used in the microelectronics industry for dicing or scribing thin, fragile wafers. It is designed for high-precision wafer dicing and scribing applications, particularly in the manufacturing of components such as MEMS, thin film, and dielectric. The system offers two processing modes, batch and random, each of which is suitable for different applications and offers varying levels of quality and accuracy. ADT 7100 ProVectus is equipped with an automated pick-and-place unit and integrated scribing/dicing station. The pick-and-place machine facilitates handling of wafers with a wide range of sizes (0.8mm-150mm). The tool can also be customized to meet specific requirements through the use of an auto loading asset, which allows users to load the model from a magazine as well as program the pick-and-place parameters to handle wafers with a variety of shapes. The integrated scribing/dicing station allows for a precision scribing or dicing process. It includes a powerful laser for scribing and a replaceable silicon carbide blade for dicing. The blades are designed to last for a long time and to deliver consistent results. The station is also equipped with an enclosed dust collection equipment, which minimizes airborne particles and improves safety. K&S 7100 ProVectus Scribing/Dicing System is highly reliable and easy to operate. It is designed for use in a variety of high-end production environments and offers quick setup and operation. Through the included software package and intuitive keypad controls, users can easily program the unit for batch and random processing modes. Additionally, the machine includes automation and metrology systems, which allow users to monitor the process in real-time and analyze the results. In conclusion, 7100 ProVectus Scribing/Dicing Tool provides a robust and accurate scribing/dicing solution for the microelectronics industry. Its automated pick-and-place asset, continuous process monitoring, and integrated scribing/dicing station make this model a reliable choice for industries that require precision scribing and dicing of thin, fragile wafers.