Used ADT / K&S 7300 CSP #9195932 for sale

ADT / K&S 7300 CSP is a versatile scribing / dicing equipment specifically designed for the cutting, scribing, dicing and polishing of semiconductor wafers, substrates and die. This system provides greater throughput, accuracy and control than traditional manual processes. ADT 7300 CSP is a multi-axis unit that is equipped with a specialized spindle which has both a vertical and horizontal backgauge driven by two independent motors. These motors allow the machine to accurately manipulate wafers and substrates in a precise manner for further processing. In addition, the spindle has a variable-speed drive that enables it to operate at various speeds for different types of material processing. The main feature of K&S 7300 CSP is the CSP (Computerized Scribing Process) feature. This feature enables the tool to automatically align and position the wafer and substrate for any type of cutting and scribing process. The user has complete control over all aspects of the process such as scribing width, scribing depth, cutting speed and power levels. The CSP feature also monitors the process state during the cutting and scribing operations to ensure accurate results. In addition to the CSP feature, 7300 CSP is equipped with a variety of control and monitoring tools. The asset includes a color touch screen display which provides model configuration, status and diagnostic feedback. It also has a standard Ethernet connection for remote communication and control. Two cameras are included on the equipment which provides a constantly changing view of the cut-off plane and scanning capability. The system also includes safety barriers for improved safety in the operator's environment. ADT / K&S 7300 CSP is designed for easy integration into existing production and inspection processes. It is compatible with several standard PC platforms and can be interfaced with third-party software such as CAD software, process control software and SCADA monitoring systems. ADT 7300 CSP is an extremely versatile scribing / dicing unit which offers greater accuracy and throughput than manual processes. With its CSP feature and a variety of control and monitoring tools, it is an ideal choice for precise cutting, scribing, slicing and polishing operations on semiconductor wafers and substrates.