Used DISCO 6340 #293615371 for sale

DISCO 6340 is a versatile scribing and dicing equipment used for processing wafers and other microelectronic materials. The machine is equipped with a high-precision scribing head, a carbide sawing chuck and an integrated vacuum system, making it perfect for high-accuracy, low-cost applications. The scribing head features a two-axis gantry robot with a 4000 mm/s cutting speed. It is integrated with advanced motion control components and a 50,000 RPM motor to allow extremely fast and precise scribing and dicing of wafers. The motor is able to deliver full torque even at high speed which makes the unit particularly effective when cutting materials with a high amount of adhesive. The carbide sawing chuck is designed to process fragile materials such as silicon, quartz and indium phosphide. The precision-machined chuck has a saw blade area of 250 mm and can be used to saw depths of up to 1.5 mm. The chuck is adjustable and has adjustable speed and saw blade pressure, allowing it to be optimized for the specific process. The integrated vacuum machine on 6340 is capable of up to 8,000 mmHg of suction. This vacuum is used to secure and stabilize the materials during the scribing and sawing processes, ensuring a safe and reliable operation. The tool is also equipped with an auto-cleaning filter and a line filter to ensure a dust-free environment. DISCO 6340 is a powerful and reliable asset for scribing and dicing wafers and other microelectronic materials. The high-speed, precise motion control combined with the advanced sawing chuck and vacuum model makes it the ideal choice for numerous applications. The high-precision tools, adjustable speed and pressure settings and integrated safety features makes it a reliable and user-friendly equipment for a wide range of scribing and dicing operations.