Used DISCO DAC 2SP/65 #62352 for sale

DISCO DAC 2SP/65 is a high-performance, industrial-grade scribing / dicing equipment designed specifically for the efficient handling of wafers, semiconductors and other microelectronic components. This system is designed to perform precise, high-speed scribing and dicing-off operations ('dicing') of various sizes of materials, including thin and tough stainless steel. The DAC 2SP/65 is made up of two main components - the scribing unit and the dicing unit. The scribing unit is a precision engraver that is used to scribe patterns on the surface of the material. This includes producing grooves for lead frames, blind via holes, and precise edges for components. This unit utilizes the latest precision motion and vision technologies, allowing precise cutting and scribing of even the thinnest wafer layers. The dicing unit is an automated cutting machine that is specifically designed for the precise and efficient cutting of tiny components. This unit uses patented blade mechanics, high-speed cutting heads, and automated precise location recognition and placement systems to ensure efficient and repeatable results. The DAC 2SP/65 also features a variety of advanced dicing options: a double-head dicing operation, a high-yield double-dicing operation, and various single-head dicing operations. The DAC 2SP/65 is designed to be both efficient and reliable. The unit is capable of performing a maximum of 1000 dices per hour, with speeds up to 330 microns per second; the unit is highly automated and equipped with safety switches and a built-in fault detector. The machine's cutting edges are constantly monitored and adjusted in order to maintain their length and shape, allowing for high quality and repeatable results. Overall, DISCO DAC 2SP/65 is a highly advanced, high-performance scribing / dicing tool that is specifically designed for precision and efficiency. This asset is capable of handling various sizes of materials and performing various types of cutting and scribing operations, and is designed to be both reliable and efficient. This model is perfect for tasks that require precise, high-performance scribing and dicing, such as semiconductors and wafer processing.