Used DISCO DAC 552 #9400671 for sale

DISCO DAC 552 is a scribing and dicing equipment designed for semiconductor device manufacturing processes. It is capable of performing a variety of functions, including high-precision cutting, scribing, and dicing. The system is especially useful in assembling semiconductor devices that have a large number of components, such as dies and integrated circuits. The unit consists of an automated mechanism that moves a mechanical knife, called a "scriber", along a path under computer control. The scriber contains a large number of highly-refined sharp blades and is designed to cut through semiconductor materials such as silicon and gallium arsenide. The cutting speed is adjustable, to optimize the cutting performance for different materials. DISCO DAC-552 is equipped with a high-resolution camera. This enables the machine to identify and isolate the desired device components for dicing. The tool is designed to do so with accuracy to 0.1 micron. Once the components are isolated, the scriber is activated to cut the desired parts from the semiconductor material. DAC 552 also has a vision asset that enables it to detect defects and structural imperfections in a semiconductor die, such as voids and cracks in the surface of the material. This model is particularly useful in making sure that each component is cut to exact specifications. In addition, DAC-552 has a vacuum table that securely holds the components in place during the cutting and dicing process. This table helps to ensure that the device components are held firmly in place during the entire scribing process. Finally, DISCO DAC 552 includes a dust and debris collection equipment, which helps to keep the production line free of contaminants. A variety of suction hoses are connected to the system to remove any dust particles created during the processing. In conclusion, DISCO DAC-552 is an advanced scribing and dicing unit designed for semiconductor device manufacturing. The machine is designed for accuracy and efficiency, and is an invaluable tool for ensuring that die and integrated circuits are accurately cut and diced.